Startseite Microstructural evolution and mechanical properties of thixoformed 7075 aluminum alloy prepared by conventional and new modified SIMA processes
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Microstructural evolution and mechanical properties of thixoformed 7075 aluminum alloy prepared by conventional and new modified SIMA processes

  • Behzad Binesh , Mehrdad Aghaie-Khafri , Mehdi Shaban und Ali Fardi-Ilkhchy
Veröffentlicht/Copyright: 29. November 2018
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Abstract

The microstructural evolution during semi-solid processing and thixoformability of a 7075 alloy prepared by conventional and new modified strain induced melt activation (SIMA) processes were comparatively investigated in this paper. The semi-solid slurries were thixoformed at 600 °C, at which temperature the solid fraction was estimated to be 0.8. The coarsening process of the semi-solid samples was described using Lifshitz–Slyozov–Wagner theory and the effect of pre-deformation on the coarsening kinetics of the solid particles was discussed. The coarsening rate constant of the new modified SIMA sample showed a remarkable decrease compared to that of the conventional SIMA sample. Microstructural and mechanical investigations indicated that the sample with a near-equiaxed microstructure deforms through the plastic deformation of solid grains mechanism. However, the sliding of solid grains and flow of liquid incorporating solid grains mechanisms were dominant in the sample with a globular microstructure. Also, it was observed that the yield and ultimate strengths and hardness of the sample prepared by the new modified SIMA process after thixoforming and T6 heat treatment increased by about 15 %, 10 % and 25 % respectively, compared to those of the conventional SIMA sample.


*Correspondence address, Dr. Behzad Binesh, Department of Materials Science and Engineering, University of Bonab, Postal Code: 5551761167, Bonab, Iran, Tel.: +989141220290, Fax: +984137740800, E-mail:

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Received: 2018-04-21
Accepted: 2018-06-28
Published Online: 2018-11-29
Published in Print: 2018-12-10

© 2018, Carl Hanser Verlag, München

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