High-performance thermoplastic polymers, such as polyetheretherketone (PEEK), are frequently utilized in engineering applications, particularly when superior mechanical properties, enhanced thermal stability, and chemical resistance are required. However, their composites are subjected to process challenges, including even dispersion, process compatibility, and improved moisture absorption behaviour. This research aims to mitigate the disputes above and enhance the functional properties of PEEK composites by adding short hemp fiber through hot pressing technology. To enhance the fiber quality and reduce the moisture absorption behaviour, the hemp fiber (HF) undergoes sodium hydroxide (NaOH) surface treatment, and the final composites contain 0, 15, 30, and 45 wt% of short HF (treated). During the fabrication process, 5 % polyetherimide (PEI) was used as a compatibilizer to enhance the adhesive and thermal behaviour of the composite samples. The effectiveness of processing on the microstructural behaviour of the composite is analyzed via transmission electron microscopy (TEM), and HF is found to have a coarse and wide distribution, resulting in improved functional properties. The effect of HF content on the microstructural, moisture absorption, electrical properties, microhardness, and thermal stability of synthesized composites is investigated. The composite of PEEK with 45 wt% of short HF with 5 % PEI has low moisture absorption of 0.4 %, increased dielectric constant of 4, reduced surface resistance of 1.1 × 10 9 Ωcm, enhanced microhardness of 28 HV and improved thermal stability. It is recommended for Printed Circuit Boards (FPCBs) and microcircuit applications.
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