The effect of styrene isoprene diblock content on hot melt label pressure-sensitive adhesives properties

Fariba Mohammadi; Ebrahim Hashemi

doi:10.1515/ipp-2025-0040

Article

The effect of styrene isoprene diblock content on hot melt label pressure-sensitive adhesives properties

Fariba Mohammadi and Ebrahim Hashemi

Published/Copyright: September 15, 2025

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From the journal International Polymer Processing Volume 40 Issue 5

Abstract

Styrene-isoprene-styrene (SIS) based hot melt pressure sensitive adhesives (HMPSAs) have high tack, high cohesion (at ambient temperature), and good adhesion to various substrates. In this study, we investigated the effects of styrene-isoprene diblock content in SIS copolymer on the characteristics of SIS-based HMPSAs and used them for labels. We found that styrene-isoprene (SI) diblock in a styrene-isoprene-styrene (SIS) copolymer improved adhesive properties and die cutability of self adhesive labels, which is one of the most significant properties for labels. The diblock copolymer reduces the storage modulus of adhesive compounds. As the modulus is low, it improves wettability to the surface, resulting in high tack and peel, which seems to be a predominant factor on labels. The SIS used in this study is classified into low diblock SIS and high diblock SIS.

Keywords: styrene-isoprene-styrene; hot melt pressure sensitive adhesive; diblock; copolymer; die cutability; modulus

Corresponding author: Fariba Mohammadi, Irandar Industry & Manufacturing Company, Qazvin, Iran, E-mail: Mohammadi.fariba@irandar.ir

Acknowledgments

The authors thank the Respected Managing Director of Irandar Company and the Respected Director of Research Unit for their valuable advice, suggestions, and support throughout the work.

Research ethics: Not applicable. (No experiments involving human participants or animals were conducted).
Informed consent: Not applicable.
Author contributions: The author has accepted responsibility for the entire content of this manuscript and approved its submission. M.F. designed the study, data collection, data analysis, writing the manuscript, revising the manuscript and H.E. Supervising the project.
Use of Large Language Models, AI and Machine Learning Tools: None declared.
Conflict of interest: The authors state no conflict of interest.
Research funding: Irandar Company.
Data availability: Data openly available in a public repository that issues datasets with DOIs.

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Received: 2025-04-27

Accepted: 2025-08-12

Published Online: 2025-09-15

Published in Print: 2025-11-25

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Articles in the same Issue

https://doi.org/10.1515/ipp-2025-0040

Keywords for this article

styrene-isoprene-styrene; hot melt pressure sensitive adhesive; diblock; copolymer; die cutability; modulus