Hemp-PEEK composites: surface treatment, processing, and performance

Dhiravidamani Periyasamy; Jagadeesh Duraisamy; S. Prabagaran; R. Srinivasan

doi:10.1515/ipp-2025-0019

Article

Hemp-PEEK composites: surface treatment, processing, and performance

Dhiravidamani Periyasamy , Jagadeesh Duraisamy , S. Prabagaran and R. Srinivasan

Published/Copyright: September 17, 2025

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From the journal International Polymer Processing Volume 40 Issue 5

Abstract

High-performance thermoplastic polymers, such as polyetheretherketone (PEEK), are frequently utilized in engineering applications, particularly when superior mechanical properties, enhanced thermal stability, and chemical resistance are required. However, their composites are subjected to process challenges, including even dispersion, process compatibility, and improved moisture absorption behaviour. This research aims to mitigate the disputes above and enhance the functional properties of PEEK composites by adding short hemp fiber through hot pressing technology. To enhance the fiber quality and reduce the moisture absorption behaviour, the hemp fiber (HF) undergoes sodium hydroxide (NaOH) surface treatment, and the final composites contain 0, 15, 30, and 45 wt% of short HF (treated). During the fabrication process, 5 % polyetherimide (PEI) was used as a compatibilizer to enhance the adhesive and thermal behaviour of the composite samples. The effectiveness of processing on the microstructural behaviour of the composite is analyzed via transmission electron microscopy (TEM), and HF is found to have a coarse and wide distribution, resulting in improved functional properties. The effect of HF content on the microstructural, moisture absorption, electrical properties, microhardness, and thermal stability of synthesized composites is investigated. The composite of PEEK with 45 wt% of short HF with 5 % PEI has low moisture absorption of 0.4 %, increased dielectric constant of 4, reduced surface resistance of 1.1 × 10⁹ Ωcm, enhanced microhardness of 28 HV and improved thermal stability. It is recommended for Printed Circuit Boards (FPCBs) and microcircuit applications.

Keywords: electrical properties; hemp fiber; hot compression; microstructural; mechanical; PEEK

Corresponding author: Dhiravidamani Periyasamy, Department of Mechanical Engineering, KSR College of Engineering, KSR Kalvi Nagar, Tiruchengode, 637215, Tamil Nadu, India, E-mail: srinivasansimats@gmail.com

Research ethics: Not applicable.
Informed consent: Not applicable.
Author contributions: The authors have accepted responsibility for the entire content of this manuscript and approved its submission.
Use of Large Language Models, AI and Machine Learning Tools: None declared.
Conflict of interest: The authors state no conflict of interest.
Research funding: None declared.
Data availability: Not applicable.

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Received: 2025-02-20

Accepted: 2025-07-29

Published Online: 2025-09-17

Published in Print: 2025-11-25

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https://doi.org/10.1515/ipp-2025-0019

Keywords for this article

electrical properties; hemp fiber; hot compression; microstructural; mechanical; PEEK