Abstract
An attempt is made to assess the efficiency of drag effects by different structural elements of a polycrystal on grain growth. The rate of grain area change is chosen as a measure of stability of a grain structure, and the inhibition of grain growth is pairwise evaluated among all drag effects considered. In aluminium, at temperatures of about 200 °C, triple junction drag was found to be most effective. The derived hierarchy of drag efficiency can be used as an effective engineering tool to assess and compare the role of chemistry and crystal defects on the microstructural stability of nanocrystalline and fine-grained materials.
Funding statement: Support from the Deutsche Forschungsgemeinschaft (DFG Grant 436 RUS 113/714/0 – 1(R)) is gratefully acknowledged. One of the authors (LSS) wishes to thank the Russian Foundation of Fundamental Research for financial support (Grant DFG-RRFI 03 02 04000)
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© 2004 Carl Hanser Verlag, München
Articles in the same Issue
- Frontmatter
- Editorial
- Editorial
- Articles BBasic
- The distribution of internal interfaces in polycrystals
- Analysis of grain boundary network topology using grain boundary wetting
- Kinematics of connected grain boundaries in 2D
- On the first steps of grain boundary dislocation stress relaxations in copper
- Grain boundary mobility – a brief review
- In situ TEM observations of moving interfaces during discontinuous precipitation reaction in Al-22 at.% Zn alloy
- Stress-induced migration of tilt and twist grain boundaries
- Efficiency of drag mechanisms for inhibition of grain growth in nanocrystalline materials
- A model for simulating the motion of line defects in twin boundaries in HCP metals
- Phase transitions: an alternative for stress accommodation in CMR manganate films
- Thermodynamic and kinetic influences on the morphology of moving interfaces during solid state reactions
- Interfacial reaction mechanisms and the structure of moving heterophase boundaries during pyrochlore- and spinel-forming solid state reactions
- Bifurcation of the Kirkendall plane and patterning in reactive diffusion
- Articles AApplied
- Wetting and strength in the tin – silver – titanium/sapphire system
- Intergranular films in metal-ceramic composites and the promotion of metal particle occlusion
- Evolution of intergranular boundaries and phases in SiC and Si3N4 ceramics under high temperature deformation: Case studies by analytical TEM
- Atomic structure and dynamics of massive transformation interfaces in TiAl alloy
- Notifications/Mitteilungen
- Personal/Personelles
- Books/Bücher
- Conferences/Konferenzen
- Events/Veranstaltungen
Articles in the same Issue
- Frontmatter
- Editorial
- Editorial
- Articles BBasic
- The distribution of internal interfaces in polycrystals
- Analysis of grain boundary network topology using grain boundary wetting
- Kinematics of connected grain boundaries in 2D
- On the first steps of grain boundary dislocation stress relaxations in copper
- Grain boundary mobility – a brief review
- In situ TEM observations of moving interfaces during discontinuous precipitation reaction in Al-22 at.% Zn alloy
- Stress-induced migration of tilt and twist grain boundaries
- Efficiency of drag mechanisms for inhibition of grain growth in nanocrystalline materials
- A model for simulating the motion of line defects in twin boundaries in HCP metals
- Phase transitions: an alternative for stress accommodation in CMR manganate films
- Thermodynamic and kinetic influences on the morphology of moving interfaces during solid state reactions
- Interfacial reaction mechanisms and the structure of moving heterophase boundaries during pyrochlore- and spinel-forming solid state reactions
- Bifurcation of the Kirkendall plane and patterning in reactive diffusion
- Articles AApplied
- Wetting and strength in the tin – silver – titanium/sapphire system
- Intergranular films in metal-ceramic composites and the promotion of metal particle occlusion
- Evolution of intergranular boundaries and phases in SiC and Si3N4 ceramics under high temperature deformation: Case studies by analytical TEM
- Atomic structure and dynamics of massive transformation interfaces in TiAl alloy
- Notifications/Mitteilungen
- Personal/Personelles
- Books/Bücher
- Conferences/Konferenzen
- Events/Veranstaltungen