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Kinematics of connected grain boundaries in 2D

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Published/Copyright: December 30, 2021
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 95 Issue 4

Abstract

The motion of connected boundary systems was investigated in Al and Zn tricrystals. It was found that triple junctions can exert a drag force on the adjoining boundaries owing to a lower mobility. This drag manifests itself by a deviation of the dihedral angles at the triple junction from the equilibrium angles due to grain boundary surface tensions. The strength of triple junction drag can be expressed in terms of a criterion Λ = (mtj ∙ a/mb), where mtj is the triple junction mobility, mb the boundary mobility, and a is the grain size. Therefore, the effect should be particularly pronounced in fine-grained and nanocrystalline materials. It is shown that the von Neumann–Mullins relation of 2D grain growth is modified by triple junction drag such that there is no unique relationship between growth rate and the number of sides anymore. For very small Λ, the triple junctions control grain structure evolution during grain growth, which leads to polyhedral grain shapes with flat boundaries. The theoretical concept is supported by computer simulations of grain growth and in-situ annealing experiments in the SEM.

Keywords: Grain boundaries; Triple junctions; Mobility; Von Neumann-Mullins relation; Grain growth
Prof. Dr. G. Gottstein, Institut für Metallkunde und Metallphysik, RWTH Aachen, D-52056 Aachen, Tel.: +49 241 802 6860, Fax: +49 241 802 26 08

Funding statement: The authors gratefully acknowledge financial support of their cooperation by the Deutsche Forschungsgemeinschaft (436RUS113/714/ 0–1®) and the Russian Foundation of Fundamental Research (DFG-RRFI030204000)

References

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Received: 2003-10-30
Accepted: 2004-02-03
Published Online: 2021-12-30

© 2004 Carl Hanser Verlag, München

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles BBasic
  5. The distribution of internal interfaces in polycrystals
  6. Analysis of grain boundary network topology using grain boundary wetting
  7. Kinematics of connected grain boundaries in 2D
  8. On the first steps of grain boundary dislocation stress relaxations in copper
  9. Grain boundary mobility – a brief review
  10. In situ TEM observations of moving interfaces during discontinuous precipitation reaction in Al-22 at.% Zn alloy
  11. Stress-induced migration of tilt and twist grain boundaries
  12. Efficiency of drag mechanisms for inhibition of grain growth in nanocrystalline materials
  13. A model for simulating the motion of line defects in twin boundaries in HCP metals
  14. Phase transitions: an alternative for stress accommodation in CMR manganate films
  15. Thermodynamic and kinetic influences on the morphology of moving interfaces during solid state reactions
  16. Interfacial reaction mechanisms and the structure of moving heterophase boundaries during pyrochlore- and spinel-forming solid state reactions
  17. Bifurcation of the Kirkendall plane and patterning in reactive diffusion
  18. Articles AApplied
  19. Wetting and strength in the tin – silver – titanium/sapphire system
  20. Intergranular films in metal-ceramic composites and the promotion of metal particle occlusion
  21. Evolution of intergranular boundaries and phases in SiC and Si3N4 ceramics under high temperature deformation: Case studies by analytical TEM
  22. Atomic structure and dynamics of massive transformation interfaces in TiAl alloy
  23. Notifications/Mitteilungen
  24. Personal/Personelles
  25. Books/Bücher
  26. Conferences/Konferenzen
  27. Events/Veranstaltungen
https://doi.org/10.3139/ijmr-2004-0045
Keywords for this article
Grain boundaries; Triple junctions; Mobility; Von Neumann-Mullins relation; Grain growth

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles BBasic
  5. The distribution of internal interfaces in polycrystals
  6. Analysis of grain boundary network topology using grain boundary wetting
  7. Kinematics of connected grain boundaries in 2D
  8. On the first steps of grain boundary dislocation stress relaxations in copper
  9. Grain boundary mobility – a brief review
  10. In situ TEM observations of moving interfaces during discontinuous precipitation reaction in Al-22 at.% Zn alloy
  11. Stress-induced migration of tilt and twist grain boundaries
  12. Efficiency of drag mechanisms for inhibition of grain growth in nanocrystalline materials
  13. A model for simulating the motion of line defects in twin boundaries in HCP metals
  14. Phase transitions: an alternative for stress accommodation in CMR manganate films
  15. Thermodynamic and kinetic influences on the morphology of moving interfaces during solid state reactions
  16. Interfacial reaction mechanisms and the structure of moving heterophase boundaries during pyrochlore- and spinel-forming solid state reactions
  17. Bifurcation of the Kirkendall plane and patterning in reactive diffusion
  18. Articles AApplied
  19. Wetting and strength in the tin – silver – titanium/sapphire system
  20. Intergranular films in metal-ceramic composites and the promotion of metal particle occlusion
  21. Evolution of intergranular boundaries and phases in SiC and Si3N4 ceramics under high temperature deformation: Case studies by analytical TEM
  22. Atomic structure and dynamics of massive transformation interfaces in TiAl alloy
  23. Notifications/Mitteilungen
  24. Personal/Personelles
  25. Books/Bücher
  26. Conferences/Konferenzen
  27. Events/Veranstaltungen
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