Startseite Interfacial Reactions between Lead-Free Solders and the Multilayer Au/Ni/SUS304 Substrate
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Interfacial Reactions between Lead-Free Solders and the Multilayer Au/Ni/SUS304 Substrate

  • Yee-Wen Yen , Chun-Yu Lee , Meng-Han Kuo , Kuo-Sing Chao und Kuen-Da Chen
Veröffentlicht/Copyright: 11. Juni 2013
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Abstract

Interfacial reactions between Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and an Au/Ni/SUS304 stainless steel (SUS304) substrate were conducted using the reaction couple technique at 240, 255 and 270 °C for 1 – 5 h. In the earliest stage of the reaction, only the Ni3Sn4 phase was formed on the Sn/Au/Ni/SUS304 interface. As the reaction time increased to 4 h, the Ni layer was gradually consumed and the Ni3Sn4 phase detached from the interface. Meanwhile, the Sn reacted with the SUS304 to form the FeSn2 phase. In the SAC/Au/Ni/SUS304 reaction couple, both Ni3Sn4 and Cu6Sn5 phases were formed on the interface. When the reaction time exceeded 4 h, the Ni3Sn4 phase disappeared; the Cu6Sn5 phase was spread over the SUS304 surface and the FeSn2 phase was formed on the SUS304 surface. The growth of intermetallic compounds can be described by the parabolic law and the reactions were diffusion-controlled.


* Correspondence address, Prof. Yee-Wen Yen, National Taiwan University of Science and Technology, Graduate Institute of Materials Science and Technology, 43 Keelung Road, Sec. 4, Taipei 10672, Taiwan, ROC, Tel.: +886 2 2737 6659, Fax: +886 2 2730 1265, E-mail:

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Received: 2008-1-10
Accepted: 2008-11-4
Published Online: 2013-06-11
Published in Print: 2009-05-01

© 2009, Carl Hanser Verlag, München

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