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Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

  • Yee-Wen Yen , Weng-Ting Chou , Hong-Chih Chen , Wei-Kai Liou and Chiapyng Lee
Published/Copyright: June 11, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 99 Issue 11

Abstract

Interfacial reactions and mechanical properties between the Cu and Pb-free solders, Sn-3.0Ag-0.5Cu and Sn-58Bi with addition of 0.1 to 1.0 wt.% Pb are investigated in this study. Two kinds of intermetallic compounds, scallop-shaped Cu6Sn5 and plane layered Cu3Sn phases, were found in both Sn-3.0Ag-0.5Cu + Pb/Cu and Sn-58Bi + Pb/Cu couples. The intermetallic compound thickness increased with longer reaction times, higher reaction temperatures and greater Pb contents. The Cu6Sn5 phase was the thicker intermetallic compound in the Sn-3.0Ag-0.5Cu + Pb/Cu couple. However, in the Sn-58Bi + Pb/Cu system, the Cu3Sn phase is the thicker intermetallic compound. Experimental results indicate that the higher Pb concentration in Sn-3.0Ag-0.5Cu or Sn-58Bi solders reduces the alloy liquidus temperature and increases the thickness of the intermetallic compound. Thicker intermetallic compounds reduce the mechanical strength of the solder joint.

Keywords: Interfacial reaction; Pb-free solder; Intermetallic compound; Liquidus temperature; Mechanical strength
* Correspondence address, Prof. Yee-Wen Yen, National Taiwan University of Science and Technology, Graduate Institute of Materials Science and Technology, 43Keelung Road, Sec. 4, Taipei 10672, Taiwan, ROC, Tel.: +886 22 737 6659, Fax: +886 22 730 1265, E-mail:

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Received: 2007-9-28
Accepted: 2008-7-11
Published Online: 2013-06-11
Published in Print: 2008-11-01

© 2008, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.101760
Keywords for this article
Interfacial reaction; Pb-free solder; Intermetallic compound; Liquidus temperature; Mechanical strength

Articles in the same Issue

  1. Contents
  2. Contents
  3. Basic
  4. A model to calculate the viscosity of silicate melts
  5. A model to calculate the viscosity of silicate melts
  6. A note on the application of the phase rule
  7. Thermodynamic properties of liquid silver–indium–tin alloys determined from emf measurements
  8. Unconstrained solidification and characterisation of near-eutectic Al–Cu–Ag alloys
  9. Tensile properties of L12 intermetallic foils fabricated by cold rolling
  10. Microstructural control of FeB-inoculated mottled low-alloy white iron by a design of experiments approach
  11. Applied
  12. Dislocation structure and crystallite size distribution in lath martensite determined by X-ray diffraction peak profile analysis
  13. Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints
  14. Elastic properties of braided ceramic matrix composites
  15. The influence of microstructural characteristics and contaminants on the mechanical properties and fracture topography of low cost Ti6Al4V alloy
  16. Microstructure and room temperature mechanical properties of Hf and Sn-doped Nb-20Ti-5Cr-3Al-18Si alloy
  17. The effect of alloying elements on constrained carbon equilibrium due to a quench and partition process
  18. Hardfacing behavior of Cr–Ni stainless steel with Co-based super alloys
  19. Development of SMD 32.768 kHz tuning fork-type crystals
  20. Notification
  21. DGM News
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