A novel procedure for failure criteria determination at solder joints under the board level drop test

Jian Gu; Yongping Lei; Jian Lin; Guichen Wen; Hanguang Fu

doi:10.3139/120.110750

Article

A novel procedure for failure criteria determination at solder joints under the board level drop test

Jian Gu , Yongping Lei , Jian Lin , Guichen Wen and Hanguang Fu

Published/Copyright: May 15, 2015

Published by

Become an author with De Gruyter Brill

Submit Manuscript Author Information

From the journal Materials Testing Volume 57 Issue 6

Abstract

Controlling and monitoring of dynamic responses are very important to ensure consistent test results and understand mechanical behaviors, as they are closely related to the solder joint failure mechanism. The failure of a solder joint during drop impact is induced by printed circuit board (PCB) bending. The failure criteria must be clear to determine the absolute impact life for direct comparison of drop test results. In this publication, a multi-channel real time electrical monitoring system is introduced, which can measure the dynamic voltage of daisy-chained solder joints in real-time during drop impact. A new failure criteria of board level drop test is developed, which takes the function of the component into account.

Kurzfassung

Die Kontrolle und die Aufzeichnung des dynamischen Verhaltens sind sehr wichtig, um konsistente Versuchsergebnisse zu erhalten und um das mechanische Verhalten zu verstehen, zumal sie eng mit den Schädigungsmechanismen von Lötverbindungen zusammenhängen. Die Schädigung einer Lötverbindung während des Fallversuches wird mittels Printed Circuit Board (PCB) Biegung erreicht. Dabei müssen die Schädigungskriterien klar sein, um die absolute Lebensdauer unter schlagartiger Beanspruchung für einen direkten Vergleich von Fallversuchsergebnissen zu bestimmen. In dem vorliegenden Beitrag wird ein elektrisches Multikanal-Echtzeit-Aufzeichnungssystem vorgestellt, das die dynamische Spannung von reihengeschalteten Lötverbindungen in Echtzeit während des Auftreffens messen kann. Es wurde ein neues Schädigungskriterium für den Fallversuch entwickelt, das die Funktion der jeweiligen Komponente berücksichtigt.

§Correspondence Address, Prof. Yongping Lei and Dr Hanguang Fu, School of Materials Science and Engineering, Beijing University of Technology, Number 100 Pingle Garden, Chaoyang District, Beijing 100124, P. R. China, E-mail: yplei@bjut.edu.cn, hgfu@bjut.edu.cn

Jian Gu, born in 1989, is a doctoral candidate at Beijing University of Technology, China. He obtained his Bachelor degree at the School of Materials Science and Engineering of Beijing University of Technology in 2011. His research interests mainly focus on the reliability of solder joint under drop impact.

Prof. Dr. Yongping Lei, born in 1957, is Professor at Beijing University of Technology, China. He obtained his PhD at the School of Materials Science and Engineering at Xi'an Jiaotong University, China in 1994. His research interests mainly focus on the development of lead-free solder paste, the reliability of solder joint and welding. By now, he has published over 100 technical papers and holds more than 50 invention patents in China.

Jian Lin, born in 1979, is Associate Professor at Beijing University of Technology, China. He obtained his PhD at Tsinghua University, China. His research interests mainly focus on the reliability of solder joint and welding.

Guichen Wen, born in 1990, is a master candidate of Beijing University of Technology, China. He obtained his Bachelor degree at the School of Materials Science and Engineering of Beijing University of Technology in 2010. His research interests mainly focus on the development of lead-free solder paste.

Dr. Hanguang Fu, born in 1964, is a researcher at the Beijing University of Technology, China. He obtained his PhD at the School of Materials Science and Engineering at Xi'an Jiaotong University, China in 2004. His research interests mainly focus on solidification control. By now, he has published over 100 technical papers and holds more than 80 invention patents in China.

References

1 ZhangB., DingH., ShengX.: Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact, Microelectronics Reliability49 (2009), No. 5, pp. 530–53610.1016/j.microrel.2009.02.024Search in Google Scholar

2 ZaalJ. J. M., van DrielW. D., HochstenbachlH. P., ZhangG. Q.: Testing solder interconnect reliability under drop impact loading conditions, Proc. of the 8th International Conference on Electronic Packaging Technology, Institute of Electrical and Electronics Engineers Inc., Shanghai, China (2007) 10.1109/ICEPT.2007.4441528Search in Google Scholar

3 WongE. H., SeahS. K. W., ShimV. P. W.: A review of board level solder joints for mobile applications, Microelectronics Reliability48 (2008), No. 11-12, pp. 1747–175810.1016/j.microrel.2008.08.006Search in Google Scholar

4 WongE. H., SeahS. K. W., SelvanayagamC. S., RajooR., van DrielW., CaersJ., ZhaoX. J., OwensN., LeoniM., TanL. C., LaiY. S., YehC. L., High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies, Journal of Electronic Materials38 (2009), No. 6, pp. 884–89510.1007/s11664-008-0610-5Search in Google Scholar

5 SyedA., TeeT. Y., NgH. S., AndersonR., KhooC. P., RogersB.: Advanced analysis on board trace reliability of WLCSP under drop impact, Microelectronics Reliability50 (2010), No. 7, pp. 928–93610.1016/j.microrel.2010.02.027Search in Google Scholar

6 WongE. H., SeahS. K. W., van DrielW. D., CaersJ., OwensN., LaiY. S.: Advances in the drop-impact reliability of solder joints for mobile applications, Microelectronics Reliability49 (2009), No. 2, pp. 139–14910.1016/j.microrel.2008.12.001Search in Google Scholar

7 ZhongZ. W., TeeT. Y.: Overview of board-level solder joint reliability modeling for single die and stacked die CSPs, Proc. of the Conf. Ieee97 (2009), No. 1, pp. 175–18310.1109/jproc.2008.2007479Search in Google Scholar

8 ChenR. S., ChengH. E., WuR. W., HuangC. H., LiaoW. C., ChuangJ. H.: Optimal design of thin-profile fine-pitch ball grid array package under drop impact test, Proc. of the Institution of Mechanical Engineers Part C – Journal of Mechanical Engineering Science C225 (2011), No. 12, pp. 2775–279110.1177/0954406211411248Search in Google Scholar

9 AnT., QinF.: A simplified computational model for solder joints under drop impact loadings, Proc. of the Intern. Conf. on Electronic Packaging Technology & High Density Packaging, Beijing (2009), pp. 133–138Search in Google Scholar

10 PunK., CuiC. Q.: Enhancement of TBGA substrate in packing drop test, Proc. of the Intern. Conf. on Electronic Packaging Technology & High Density Packaging, Beijing (2009), pp. 1016–1022Search in Google Scholar

11 ZaalJ. J. M., HochstenbachH. P., van DrielW. D., ZhangG. Q.: Solder interconnect reliability under drop impact loading conditions using high-speed cold bump pull, Microelectronics Reliability49 (2009), No. 8, pp. 846–85210.1016/j.microrel.2009.03.008Search in Google Scholar

12 ZhangB., XiJ. S., LiuP. K., DingH.: Failure analysis of board-level Sn-Ag-Cu solder interconnections under JEDEC standard drop test, Journal of Electronic Materials42 (2013), No. 9, pp. 2848–285510.1007/s11664-013-2661-5Search in Google Scholar

13 AnT., QinF.: Cracking of the intermetallic compound layer in solder joints under drop impact loading, Journal of Electronic Packaging133 (2011), No. 3, 03100410.1115/1.4004870Search in Google Scholar

14 AnT., QinF., LiJ. G.: Influence of strain rate effect on behavior of solder joints under drop impact loadings, Proc. of the Intern. Conf. on Electronic Packaging Technology & High Density Packaging, Beijing (2009), pp. 299–302Search in Google Scholar

15 YauY. H., HuaS. N.: A comprehensive review of drop impact modeling on portable electronic devices, Applied Mechanics Reviews64 (2011), No. 210.1115/1.4005283Search in Google Scholar

16 CaersJ., WongE. H., SeahS. K. W., ZhaoX. J., SelvanayagamC. S., van DrielW. D., OwensN., LeoniM., TanL. C., EuP. L., LaiY. S., YehC. L.: A study of crack propagation in Pb-free solder joints under drop impact, Proc. of the 58^th Electronic Components & Technology Conference, New York, USA (2008), pp. 1166–1172Search in Google Scholar

17 LuanJ. E., TeeT. Y., PekE., LimC. T., ZhongZ. W.: Dynamic responses and solder joint reliability under board level drop test, Microelectronics Reliability47 (2007), No. 2-3, pp. 450–46010.1016/j.microrel.2006.05.012Search in Google Scholar

18 ZhaoJ., LiuF., ZhouX., ZhouH., JingJ., ZhaoM.: Improvement of JEDEC drop test in SJR qualification through alternative test board design, Proc. of the 57^th Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers (2007), pp. 946–95010.1109/ECTC.2007.373910Search in Google Scholar

19 BarradoA., VazquezR., LazaroA., PleiteJ., OliasE.: Linear-non-linear control applied to switching power supplies to get fast transient response, Proc. of the 28^th Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers (2002), pp. 485–49010.1109/IECON.2002.1187556Search in Google Scholar

20 YeD., WangX., LiuD., ZhaoY., ShenS.: Design of a low-cost and high-performance DC linear power supply using in electronic experiment, IEEE Computer Society, Harbin (2011), pp. 1103–110610.1109/CSQRWC.2011.6037151Search in Google Scholar

Published Online: 2015-05-15

Published in Print: 2015-06-01

You are currently not able to access this content.

Articles in the same Issue

https://doi.org/10.3139/120.110750