Metal Deposition by Inducing a Microgalvanic Cell with the Scanning Electrochemical Microscope (SECM)
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Valentin Radtke
A new mechanism of metal deposition on conducting surfaces is presented. But in contrast to former procedures where metal ions were deposited by electrolysis on a conducting cathodically polarised surface, now the deposition occurs without any additional electrochemical energy even if the substrate metal is more noble than the deposited metal. This phenomenon can be explained by the formation of a microgalvanic cell as a consequence of the tip reaction. The process is similar to the effects of a local element well known in corrosion science. The latter one is an undesirable effect due to surface impurities whereas the former one can be targeted on generating microstructures. In this paper, we will show that the mechanism of deposition is congenerous to that one of the positive feedback, since both may occur on a nonpolarised conducting surface. Both are “tip-induced” electrochemical cells with a positive electromotive force.
© Oldenbourg Wissenschaftsverlag
Articles in the same Issue
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- Monte Carlo Simulation of Kinetically Limited Electrodeposition on a Surface with Metal Seed Clusters
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- Voltammetry and Electrocatalysis of Achromobacter Xylosoxidans Copper Nitrite Reductase on Functionalized Au(111)-Electrode Surfaces
- Electrocatalytic Trends on IB Group Metals: The Oxygen Reduction Reaction
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Articles in the same Issue
- Preface: Dieter Kolb zum 65. Geburtstag
- Precursor Adsorption of SbBr3 on Au(111) and Au(100) for Antimony Underpotential Deposition in a BMIBF4 Ionic Liquid – A Comparison with SbCl3
- Electroreduction of Nitrate at Copper Electrodes and Copper-PANI Composite Layers
- Potential Program Invariant Representation of Diffusion–Adsorption Related Voltammograms
- A Way for Determining the Effective Three Phase Boundary Width of Solid State Electrochemical Reactions from the Primary and Secondary Current Distribution at Microelectrodes
- Carbon Nanotubes and Electrochemistry
- Pd3Fe and Pt Monolayer-Modified Pd3Fe Electrocatalysts for Oxygen Reduction
- Electrochemical Nucleation and Growth Kinetics of Nanostructured Gold on Rotating Disc and Stationary Electrodes
- Theoretical Trends in Particle Size Effects for the Oxygen Reduction Reaction
- Metal Deposition by Inducing a Microgalvanic Cell with the Scanning Electrochemical Microscope (SECM)
- Formation of a Molecular Glue Based on the Electrochemical Reduction of 4-Hydroxyphenyldiazonium for the Attachment of Thin Sol–Gel Film on Glassy Carbon
- Confined Spatio-Temporal Chaos During Metal Electrodissolution: Simulations
- Comparative Study of Thymine Adsorption on Cu- and Ag-Adlayers on Au(111) Electrodes
- The Adsorption and Growth of Copper on As-Terminated GaAs(001): Physical Vapour versus Electrochemical Deposition
- Monte Carlo Simulation of Kinetically Limited Electrodeposition on a Surface with Metal Seed Clusters
- Normalized Differential Reflectance Spectroscopy at Polycrystalline Platinum Electrodes in Aqueous Acidic Electrolytes: Quantitative Aspects
- Hydrogen Adsorption on Activated Platinum Electrodes – An Electrochemical Impedance Spectroscopy Study
- Voltammetry and Electrocatalysis of Achromobacter Xylosoxidans Copper Nitrite Reductase on Functionalized Au(111)-Electrode Surfaces
- Electrocatalytic Trends on IB Group Metals: The Oxygen Reduction Reaction
- DFT Studies on the Nature of Coadsorbates on SO42-/Au(111)
- In Situ Scanning Tunnelling Microscopy in Ionic Liquids: Prospects and Challenges