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Electrolytic etching of copper for grain size determination
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S. Spannbauer
Stefan Spannbauer Trained materials tester, since 2021 student at Aalen University in the bachelor’s program “Materialography/New Materials”. After successfully completing his Bachelor’s degree, he will start his Master’s degree in “Advanced Materials and Manufacturing” in September 2025
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T. Bernthaler
Veröffentlicht/Copyright:
22. November 2024
Received: 2024-10-01
Accepted: 2024-10-20
Published Online: 2024-11-22
Published in Print: 2024-11-26
© 2024 Walter de Gruyter GmbH, Berlin/Boston
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Artikel in diesem Heft
- Contents
- Editorial
- Editorial
- Preparation of very thin wires and foils
- Electrolytic etching of copper for grain size determination
- Precipitation reconstruction of a diffusion brazed austenite joint with Ni-filler
- Preparation methodology for the microstructural characterization of diffusion layers in a titanium/steel composite
- Impact of the manufacturing process on the quality of welds in twin wire mesh fencing
- Picture of the Month
- Picture of the Month
- News
- News
Schlagwörter für diesen Artikel
Grain size measuring;
electrolytic etching;
copper;
grain boundary;
etching;
twins
Artikel in diesem Heft
- Contents
- Editorial
- Editorial
- Preparation of very thin wires and foils
- Electrolytic etching of copper for grain size determination
- Precipitation reconstruction of a diffusion brazed austenite joint with Ni-filler
- Preparation methodology for the microstructural characterization of diffusion layers in a titanium/steel composite
- Impact of the manufacturing process on the quality of welds in twin wire mesh fencing
- Picture of the Month
- Picture of the Month
- News
- News
