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Material-related fundamentals of cutting techniques for GaAs wafer manufacturing

  • Ralf Hammer EMAIL logo , Frank Bergner , Tilo Flade , Manfred Jurisch , André Kleinwechter und Michael Schaper
Veröffentlicht/Copyright: 16. Februar 2022
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Abstract

Driven by the requirement of high cutting efficiency and improvement of wafer flatness, wire sawing of GaAs single crystals under brittle material removal conditions has been studied. Crack nucleation and crack propagation were investigated by indentation and scratching tests on polished {100}-oriented semi-insulating GaAs wafers. Based on these results a concept has been developed that allows to control the force balance in the cutting slits so that the deflection of the wires perpendicular to the cutting planes is minimal resulting in cuts of high flatness. The concept has been successfully introduced in mass production of GaAs wafers.


Dr. Ralf Hammer Freiberger Compound Materials GmbH Am Junger Loewe Schacht 5, D-09599 Freiberg, Germany Tel.: +49 3731 280 222 Fax: +49 3731 280 106

Dedicated to Professor Dr.-Ing. habil. Dr. h. c. Heinrich Oettel on the occasion of his 65th birthday


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Received: 2004-12-07
Accepted: 2005-02-13
Published Online: 2022-02-16

© 2005 Carl Hanser Verlag, München

Artikel in diesem Heft

  1. Frontmatter
  2. Editorial
  3. Heinrich Oettel – 65 Jahre
  4. Articles Basic
  5. Misorientations and geometrically necessary dislocations in deformed copper crystals: A microstructural analysis of X-ray rocking curves
  6. Microstructure and lattice defects in highly deformed metals by X-ray diffraction whole powder pattern modelling
  7. Magnetoplasticity
  8. Articles Applied
  9. Finite-element analysis of the hot-pressing consolidation of continuous Al2O3 fibers-reinforced NiAl composites
  10. Modelling the stress state of a thermal barrier coating system at high temperatures
  11. Impedance spectroscopy of thermal barrier coatings as non-destructive evaluation tool for failure detection
  12. Diffraction by image processing and its application in materials science
  13. On the preferred orientation in Ti1–xAlxN and Ti1–xyAlxSiyN thin films
  14. Boron segregation and creep in ultra-fine grained tempered martensite ferritic steels
  15. Numeric simulation of the α/γ-phase ratio of ferritic-austenitic duplex steels
  16. Deformation behaviour and microscopic investigations of cyclically loaded railway wheels and tyres
  17. Similarity considerations on the simulation of turning processes of steels
  18. Crack-tip residual stresses and crack propagation in cyclically-loaded specimens under different loading modes
  19. On the effect of oxide scale stability on the internal nitridation process in high-temperature alloys
  20. Nitriding behaviour of the intermetallic alloy FeAl
  21. Material-related fundamentals of cutting techniques for GaAs wafer manufacturing
  22. Determination of RuAl phase boundaries in binary Ru–Al phase diagram at room temperature and 1200 °C
  23. On the Orowan stress in intermetallic ODS alloys and its superposition with grain size and solid solution hardening
  24. Effects of particle reinforcement on creep behaviour of AlSi1MgCu
  25. Effect of preaging on the precipitation behaviour of AlMgSi1
  26. Corrosion behaviour of hard coatings on Mg substrates
  27. Phase transformations in creep resistant MgYNdScMn alloy
  28. Notifications/Mitteilungen
  29. Personal/Personelles
  30. Press/Presse
  31. Conferences
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