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Hot deformation characteristics of Ti-6Al-4V

  • L.X. Li , K.P. Rao EMAIL logo , Y. Lou and D.S. Peng
Published/Copyright: February 7, 2022
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Abstract

The flow behavior and hot deformation mechanisms of Ti-6Al-4Vin both β and (α + β) phase regions have been studied by compression tests in the temperature range 750 – 1100 °C and strain rate range 0.05 –15 s –1. The flow curves displayed discontinuous yielding at temperatures above 850 °C and high strain rates, typically 5 and 15 s–1. Flow oscillations were also observed under such conditions. The relative discontinuous flow stress drop increased with increasing temperature in the (α + β) phase region and reached a steady state in the β phase region. The discontinuous yielding is attributed to the sudden increase in the mobile dislocation density occurring due to the activation of β grain boundary sources during hot deformation. The apparent activation energy estimated using the standard kinetic analysis is about 246 kJ/mol in the β region and 621 kJ/ mol in the (α + β) region while the strain rate sensitivity values are 0.34 and 0.18, respectively. The mechanism in the β region has been suggested to involve grain boundary sliding and dynamic recovery of the β phase while in the (α + β) region a transient mechanism, involving dynamic recovery followed by post deformation recrystallization, has been proposed.


Dr. K.P. Rao Department of Manufacturing Engineering and Engineering Management City University of Hong Kong Tat Chee Avenue, Kowloon, Hong Kong Tel.: +852 27 88 84 09 Fax: +852 27 88 84 23

  1. Part of the work presented here was supported by a grant from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project No. CityU 1086/98E). The authors would like to express their gratitude to Prof. Y.V.R.K. Prasad, Department of Metallurgy, Indian Institute of Science, Bangalore, India, for his valuable comments and suggestions during the preparation of this paper.

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Received: 2002-06-21
Published Online: 2022-02-07

© 2003 Carl Hanser Verlag, München

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