Strength and ductility of thin Cu wires
-
Golta Khatibi
and
Brigitte Weiss
Abstract
The stress– strain behavior of thin copper wires in the range 20 – 250 μm diameter and various purities (3N, 5N) have been investigated. The wires were subjected to a recrystallization heat treatment and tensile properties were determined. Tensile testing was performed using a microtensile testing machine equipped with a non-contacting laser-optical speckle correlation sensor adapted for high-resolution strain measurement. The fracture elongation of all specimens exhibited lower values than that of bulk Cu with a decreasing trend for thinner wires. High-purity wires with a pronounced bamboo structure showed a size dependence of the yield strength which increased with decreasing wire diameter. Surface topography and fracture surfaces of the specimens were examined. The microstructural investigations were performed to arrive at an understanding and interpretation of our experimental results.
Abstract
Das Spannung–Dehnung-Verhalten von dünnen Cu Drähten zwischen 20 und 250 μm Durchmesser und unterschiedlichen Reinheitsgraden (5N, 3N) wurde untersucht. Die Bestimmung der Zugfestigkeitseigenschaften der rekristallisierten Drähte erfolgte mit Hilfe einer Mikrozugfestigkeitsprüfanlage, die mit einem berührungslosen laseroptischen Korrelationssensor für hochauflösende Dehnungsmessungen ausgerüstet war. Die Bruchdehnungen aller Drahtproben zeigten geringere Werte als für massive Proben, mit einer abnehmenden Tendenz für dünnere Drähte. Die hochreinen Drähte mit einer ausgeprägten Bambus-Struktur wiesen eine Abhängigkeit der Streckgrenze vom Drahtdurchmesser auf, mit einer Zunahme der Messwerte mit abnehmendem Durchmesser. Oberflächentopographie und Bruchflächenausbildung der geprüften Proben wurden untersucht, um die experimentellen Ergebnisse zu verstehen und zu interpretieren.
Dedicated to Professor Dr. Otmar Vöhringer on the occasion of his 65th birthday
The research work was partly funded by the Austrian Research Foundation (Project No. P-14732 TEC). The authors thank Mag. R. Rettner for unpublished experimental data and Prof. V. Gröger for helpful discussions.
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© 2003 Carl Hanser Verlag, München
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Articles in the same Issue
- Frontmatter
- Articles/Aufsätze
- Bedeutung von Eigenspannungsabbau und mikrostrukturellen Veränderungen für die Lebensdauervorhersage schwingbeanspruchter Schweißverbindungen
- Factors affecting cyclic lifetime of EB-PVD thermal barrier coatings with various bond coats
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- Crystal orientation and residual stress in TiN film by synchrotron radiation
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- Strength and ductility of thin Cu wires
- Modeling of deformation behavior of copper under equal channel angular pressing
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- Personal/Personelles
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- Conferences/Konferenzen
