Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)
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Johannes Konnerth
, David Harper , Seung-Hwan Lee , Timothy G. Rials and Wolfgang Gindl
Abstract
Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.
©2008 by Walter de Gruyter Berlin New York
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Articles in the same Issue
- Meetings
- Evaluation of Eucalyptus grandis Hill ex Maiden biopulping with Ceriporiopsis subvermispora under non-aseptic conditions
- Paper dry strength improvement by xyloglucan addition: Wet-end application, spray coating and synergism with borate
- A new and facile method for isolation of lignin from wood based on complete wood dissolution
- Isolation and characterization of lignins from Eucalyptus grandis Hill ex Maiden and Eucalyptus globulus Labill. by enzymatic mild acidolysis (EMAL)
- Fractionation and characterization of xylan rich extracts from birch
- Polyoxometalate (POM) oxidation of lignin model compounds
- Pyrolytic cleavage mechanisms of lignin-ether linkages: A study on p-substituted dimers and trimers
- Polysaccharide degradation in waterlogged oak wood from the ancient warship Vasa
- Degradation of polyethylene glycol and hemicellulose in the Vasa
- Selection criteria of Eucalyptus globulus Labill. for production of chemithermomechanical pulps (CTMP)
- The effect of (induced) dislocations on the tensile properties of individual Norway spruce fibres
- Mode I and Mode II fracture toughness of densified Sitka spruce fabricated in an airtight atmosphere with high-temperature steam
- Characteristic properties of embedding strength for the nailing of the gonfolo rose (Qualea rosea Aubl.)
- Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)
- Laboratory screening of tropical hardwoods for natural resistance to the marine borer Limnoria quadripunctata: The role of leachable and non-leachable factors
- Decay resistance of wood treated with amino-silicone compounds
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