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Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)

  • Johannes Konnerth , David Harper , Seung-Hwan Lee , Timothy G. Rials and Wolfgang Gindl
Published/Copyright: December 5, 2007
Holzforschung
From the journal Volume 62 Issue 1

Abstract

Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.


Corresponding author. Department of Material Sciences and Process Engineering, Institute of Wood Science and Technology, BOKU-University of Natural Resources and Applied Life Sciences, Vienna, Austria Phone: +43-1-47654-4255, Fax: +43-1-47654-4295,

Received: 2007-3-26
Accepted: 2007-9-6
Published Online: 2007-12-05
Published in Print: 2008-1-1

©2008 by Walter de Gruyter Berlin New York

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