5 Electrical discharge machining of silicon: current progress and future trends
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M. A. Karim
Abstract
Silicon is the most widely used material in semiconductor industry. However, the machining of silicon has remained to be a challenge, mostly due to its brittle nature. Traditional machining processes are difficult to apply for processing silicon because on mechanical contact between the cutting tool and the workpiece. Being a non-contact process, electrical discharge machining (EDM) has the capability of machining silicon due to its moderate electrical conductivity. However, the semi-conductivity, as the name implies for silicon, has made the EDM a slower process for machining silicon in addition to other challenges. Therefore, many research studies have been carried out to improve the machinability of silicon using the EDM process. This book chapter summarizes findings from various research studies on different aspects of machining silicon using multi-scale EDM processes. The relationship between the microstructure and machinability of silicon in EDM and the effects of major operating parameters of EDM on the machining performance of silicon have been discussed. The capability of EDM in multi-scale machining of silicon has been demonstrated by discussing examples of micro-structuring in silicon using micro-EDM. Finally, a discussion on the current challenges during EDM of silicon and suggestions for future research directions has been added.
Abstract
Silicon is the most widely used material in semiconductor industry. However, the machining of silicon has remained to be a challenge, mostly due to its brittle nature. Traditional machining processes are difficult to apply for processing silicon because on mechanical contact between the cutting tool and the workpiece. Being a non-contact process, electrical discharge machining (EDM) has the capability of machining silicon due to its moderate electrical conductivity. However, the semi-conductivity, as the name implies for silicon, has made the EDM a slower process for machining silicon in addition to other challenges. Therefore, many research studies have been carried out to improve the machinability of silicon using the EDM process. This book chapter summarizes findings from various research studies on different aspects of machining silicon using multi-scale EDM processes. The relationship between the microstructure and machinability of silicon in EDM and the effects of major operating parameters of EDM on the machining performance of silicon have been discussed. The capability of EDM in multi-scale machining of silicon has been demonstrated by discussing examples of micro-structuring in silicon using micro-EDM. Finally, a discussion on the current challenges during EDM of silicon and suggestions for future research directions has been added.
Chapters in this book
- Frontmatter I
- Preface V
- Contents VII
- 1 Environmental aspects related to nonconventional machining processes 1
- 2 Vibration assisted machining: turning, drilling, cutting, and laser polishing 25
- 3 Abrasive waterjet machining of dissimilar materials stacked in a hybrid structure 91
- 4 Magnetic abrasive finishing process 119
- 5 Electrical discharge machining of silicon: current progress and future trends 139
- 6 Parametric optimization of machining characteristics of titanium alloy in WEDM 171
- About the editor 189
- Index 191
Chapters in this book
- Frontmatter I
- Preface V
- Contents VII
- 1 Environmental aspects related to nonconventional machining processes 1
- 2 Vibration assisted machining: turning, drilling, cutting, and laser polishing 25
- 3 Abrasive waterjet machining of dissimilar materials stacked in a hybrid structure 91
- 4 Magnetic abrasive finishing process 119
- 5 Electrical discharge machining of silicon: current progress and future trends 139
- 6 Parametric optimization of machining characteristics of titanium alloy in WEDM 171
- About the editor 189
- Index 191
