An experimental investigation by electrochemical impedance spectroscopy for the study of mechanism of copper electrodeposition from an acidic bath

Sudeshna Parida; Archana Mallik

doi:10.1515/ijmr-2024-0045

Article

An experimental investigation by electrochemical impedance spectroscopy for the study of mechanism of copper electrodeposition from an acidic bath

Sudeshna Parida and Archana Mallik

Published/Copyright: December 16, 2024

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From the journal International Journal of Materials Research Volume 115 Issue 11-12

Abstract

The mechanism of copper electrodeposition with varying potential investigated by using electrochemical impedance spectroscopy (EIS) has been reported in this current study. The bath of the deposit has limited and unlimited supply of copper ions to the substrate by using two counter electrodes i.e., platinum (Pt) and copper (Cu) respectively. The electrodeposition of copper on graphite electrodes was investigated by utilizing cyclic voltammetry (CV), potentiostatic and EIS methods. On the Nyquist plots, copper ion charge transfer is represented by a single capacitive constant at high frequencies while copper ion diffusion from the solution to the electrode surface is represented by a Warburg-type contribution at low frequencies. The corresponding Bode plots represent a decent matching between the experimental and fitting data. The effect of potential on double-layer capacitance, diffusion coefficient, and diffusion layer thickness along the interface of electrode and electrolyte has been discussed extensively. The morphologies of the copper particles depositing on the surface of the electrode were also studied and it shows a transition from spherical to dendritic structure as a function of deposition potential.

Keywords: Electrodeposition; Copper; Crystal structure; Electrochemical impedance spectroscopy; Double layer capacitance

Corresponding author: Sudeshna Parida, Electrometallurgy and Corrosion Laboratory, Department of Metallurgical and Materials Engineering, NIT Rourkela, Rourkela, Odisha, 769008, India, E-mail: sudeshnaparida897@gmail.com

Acknowledgments

The authors would like to thank the National Institute of Technology (NIT), Rourkela for providing the necessary financial and infrastructural supports for this research work.

Research ethics: Not applicable.
Informed consent: Not applicable.
Author contributions: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved its submission. Sudeshna Parida: writing – original draft, methodology, investigation, formal analysis. Archana Mallik: writing – review & editing, writing – original draft, supervision, resources, methodology, formal analysis, conceptualization.
Use of Large Language Models, AI and Machine Learning Tools: None declared.
Conflict of interest: The authors state no conflict of interest.
Research funding: None declared.
Data availability: Not applicable.

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Supplementary Material

This article contains supplementary material (https://doi.org/10.1515/ijmr-2024-0045).

Received: 2024-02-01

Accepted: 2024-04-09

Published Online: 2024-12-16

Published in Print: 2024-11-26

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Keywords for this article

Electrodeposition; Copper; Crystal structure; Electrochemical impedance spectroscopy; Double layer capacitance