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Interfacial reaction and shear strength of Sn–0.7Cu solder/electrolytic Ni joints with reflow time

  • Jeong-Won Yoon and Seung-Boo Jung EMAIL logo
Published/Copyright: February 2, 2022
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Abstract

The interfacial reaction, change of intermetallic compound (IMC) morphology and shear strength of Sn–0.7 wt.% Cu solder/Ni joints were investigated during reflow at 255 °C for times of up to 20 min. Up to the reaction time of 1 min, a needle-type (Cu,Ni)6Sn5 IMC with a hexagonal cross-section was formed. After reflow for 5 min, the (Ni,Cu)3Sn4IMC started to form under the (Cu,Ni)6Sn5 IMC. After prolonged reflow time, the upper (Cu,Ni)6Sn5 IMCs detached from the interface. Also, the morphology of the (Cu,Ni)6Sn5 IMC changed from needle type to dodecagonal type with increasing reflow time. In the ball shear test, the shear strength did not change significantly as a function of the reflow time. The result of the shear test indicated that the shear strength of the Sn– 0.7Cu/Ni ball-grid array solder joint was not significantly related to the thickness and spalling phenomenon of the IMCs formed at the interface.


Prof. Seung-Boo Jung Department of Advanced Materials Engineering Sungkyunkwan University 300 Cheoncheon-dong, Jangan-gu, Suwon 440–746, Korea Tel.: +82 31 290 7359 Fax: +82 31 290 7371

  1. This work was supported by grant No. RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce, Industry and Energy (MOCIE).

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Received: 2004-10-27
Accepted: 2005-05-29
Published Online: 2022-02-02

© 2005 Carl Hanser Verlag, München

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