Creep in ODS copper reinforced with tungsten short fibres – an ODS copper-matrix/tungsten-short-fibre composite
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Josef Čadek
und
Shijie Zhu
Abstract
Creep in copper dispersion-strengthened with fine alumina particles and reinforced with tungsten short fibres is investigated at three temperatures ranging from 923 to 1023 K. It is shown that creep is associated with a true threshold stress decreasing with increasing temperature more strongly than the shear modulus of copper. The true threshold stress in the composite is higher than that in the composite matrix by a factor K, by which the flow stress in the matrix is reduced due to the load transfer. The minimum creep strain rate is found to be lattice diffusion controlled and to depend on the fifth power of applied stress. The values of the apparent activation energy of creep are higher than that of the activation enthalpy of lattice self-diffusion in the composite matrix, which is fully explained in terms of the temperature dependence of the true threshold stress. The values of the apparent stress exponents are higher than the value of the true stress exponent since the true threshold stress is independent of the applied stress.
Funding statement: This work was financially supported by the Grant Agency of the Academy of Sciences of the Czech Republic (Grant No. S 204 1001). The authors thank Dr. Alena Orlová for comments on the manuscript and Ms. Eva Žáková for assistance in manuscript preparation
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© 2004 Carl Hanser Verlag, München
Artikel in diesem Heft
- Frontmatter
- Articles BBasic
- EMF measurements and thermodynamic description of the Pb–Sn–Zn liquid phase
- Thermodynamic properties of liquid Bi–Sn alloys
- Ternary thermodynamics by computer-aided Knudsen cell mass spectrometry: fcc solid Fe–Ni–Co alloys
- Mapping of the Nb–Cr–Ti phase diagram using diffusion multiples
- Photoacoustic properties of sintered NiO
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- Correlation between magnetic properties of CoFe single and CoFe/SiO2 multi-layer thin films and their microstructure, texture and internal stress state
- Study on mechanical properties of warm-rolled AISI 1015 carbon steel
- Creep in ODS copper reinforced with tungsten short fibres – an ODS copper-matrix/tungsten-short-fibre composite
- Effect of variation of microstructure on the creep and rupture strengths of a Sn-3.5% Ag lead-free solder alloy
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- Personal/Personelles
- Information
- Press/Presse
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Artikel in diesem Heft
- Frontmatter
- Articles BBasic
- EMF measurements and thermodynamic description of the Pb–Sn–Zn liquid phase
- Thermodynamic properties of liquid Bi–Sn alloys
- Ternary thermodynamics by computer-aided Knudsen cell mass spectrometry: fcc solid Fe–Ni–Co alloys
- Mapping of the Nb–Cr–Ti phase diagram using diffusion multiples
- Photoacoustic properties of sintered NiO
- Articles AApplied
- Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems
- Correlation between magnetic properties of CoFe single and CoFe/SiO2 multi-layer thin films and their microstructure, texture and internal stress state
- Study on mechanical properties of warm-rolled AISI 1015 carbon steel
- Creep in ODS copper reinforced with tungsten short fibres – an ODS copper-matrix/tungsten-short-fibre composite
- Effect of variation of microstructure on the creep and rupture strengths of a Sn-3.5% Ag lead-free solder alloy
- Notifications/Mitteilungen
- Personal/Personelles
- Information
- Press/Presse
- Books/Bücher
- Conferences/Konferenzen
