Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems
-
Christoph Luef
,
Hans Flandorfer
Abstract
The partial and integral enthalpies of mixing of molten, ternary Ag–Cu–Sn alloys were determined at 500, 700 and 900 °C using a Calvet-type microcalorimeter. Five sections in a compositional range from pure Sn to about 40 at.% Sn were investigated. The data were fitted using a Redlich–Kister–Muggiano polynomial, where the binary interaction parameters were taken from the literature. Additionally, the temperature dependence of the ternary interaction parameters was described analytically by a linear function.
In the ternary Cu–Ni–Sn system, the enthalpies of mixing were determined at 1250 °C in five sections, starting from pure Sn to about 40 at.% Sn. Again, the ternary interaction parameters were fitted using the substitutional Redlich –Kister –Muggiano model. For both ternary systems and all mentioned temperatures, isoenthalpy curves were constructed for the integral molar enthalpy of mixing.
Funding statement: The financial support of the Austrian “Fonds zur Förderung der wissenschaftlichen Forschung” (Project No. P15620-CHE) is gratefully acknowledged. This work is a contribution to the European COST 531 Action on “Lead-free Solder Materials”
References
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© 2004 Carl Hanser Verlag, München
Artikel in diesem Heft
- Frontmatter
- Articles BBasic
- EMF measurements and thermodynamic description of the Pb–Sn–Zn liquid phase
- Thermodynamic properties of liquid Bi–Sn alloys
- Ternary thermodynamics by computer-aided Knudsen cell mass spectrometry: fcc solid Fe–Ni–Co alloys
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- Photoacoustic properties of sintered NiO
- Articles AApplied
- Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems
- Correlation between magnetic properties of CoFe single and CoFe/SiO2 multi-layer thin films and their microstructure, texture and internal stress state
- Study on mechanical properties of warm-rolled AISI 1015 carbon steel
- Creep in ODS copper reinforced with tungsten short fibres – an ODS copper-matrix/tungsten-short-fibre composite
- Effect of variation of microstructure on the creep and rupture strengths of a Sn-3.5% Ag lead-free solder alloy
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- Personal/Personelles
- Information
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Artikel in diesem Heft
- Frontmatter
- Articles BBasic
- EMF measurements and thermodynamic description of the Pb–Sn–Zn liquid phase
- Thermodynamic properties of liquid Bi–Sn alloys
- Ternary thermodynamics by computer-aided Knudsen cell mass spectrometry: fcc solid Fe–Ni–Co alloys
- Mapping of the Nb–Cr–Ti phase diagram using diffusion multiples
- Photoacoustic properties of sintered NiO
- Articles AApplied
- Lead-free solder materials: experimental enthalpies of mixing in the Ag–Cu–Sn and Cu–Ni–Sn ternary systems
- Correlation between magnetic properties of CoFe single and CoFe/SiO2 multi-layer thin films and their microstructure, texture and internal stress state
- Study on mechanical properties of warm-rolled AISI 1015 carbon steel
- Creep in ODS copper reinforced with tungsten short fibres – an ODS copper-matrix/tungsten-short-fibre composite
- Effect of variation of microstructure on the creep and rupture strengths of a Sn-3.5% Ag lead-free solder alloy
- Notifications/Mitteilungen
- Personal/Personelles
- Information
- Press/Presse
- Books/Bücher
- Conferences/Konferenzen
