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Chemical reaction and stability of Ti3SiC2 in Cu during high-temperature processing of Cu/Ti3SiC2 composites

  • Yanchun Zhou EMAIL logo and Wanli Gu
Published/Copyright: December 20, 2021
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 95 Issue 1

Abstract

Chemical reactions and stability of Ti3SiC2 in Cu during processing of Cu/Ti3SiC2 composites in the temperature range of 900 – 1070 °C were investigated using X-ray diffraction and scanning electron microscopy. The results indicated that Cu reacted with Ti3SiC2 above 900 °C, and the reaction products were closely related to the reaction temperature and the relative ratio of Cu and Ti3SiC2. At low Ti3SiC2 content or temperatures below 1000 °C, Cu(Si) solid solution and TiCx were formed, whereas at high reaction temperature and high Ti3SiC2 content, Cu–Si intermetallic compounds like Cu5Si, Cu15Si4 and (Cu, Si) η' as well as TiCx were observed. The transporting process for the reaction was investigated and described. It was found that de-intercalation of Si from Ti3SiC2 dominated the reaction, which dissolved in copper to form Cu(Si) solid solution or Cu – Si intermetallic compounds such as Cu5Si, Cu15Si4 and (Cu, Si) η'. TiCx was always present as the decomposition product of Ti3SiC2.

Keywords: Ti3SiC2; Cu; Composite; Chemical reaction; Processing; Microstructure
Dr. Yanchun Zhou, Professor and Director of High-Performance Ceramic Division Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, P. R. China, Tel.: +86 24 2397 1765, Fax: +86 24 2389 1320

Funding statement: This work was supported by the National Outstanding Young Scientist Foundation for Y. C. Zhou under Grant No. 59925208, Natural Sciences Foundation of China under Grant No. 50232040, No. 50072034, ‘863' project, and High-tech Bureau of the Chinese Academy of Sciences

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Received: 2003-06-20
Accepted: 2003-10-07
Published Online: 2021-12-20

© 2004 Carl Hanser Verlag, München

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  16. Instructions to Authors/Richtlinien für Autoren
  17. Instructions for Authors
  18. Notifications/Mitteilungen
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  20. Press/Presse
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  22. Events/Veranstaltungen
https://doi.org/10.3139/ijmr-2004-0010
Keywords for this article
Ti3SiC2; Cu; Composite; Chemical reaction; Processing; Microstructure

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles AApplied
  5. Automated dihedral angle measurement in liquid phase sintered alloys
  6. Computer-aided analysis of repair welding of stamping tools
  7. Influence of retrogression and re-ageing on the mechanical and corrosion properties of 7039 aluminium alloy
  8. On the occurrence of Z-phase in a creep-tested 10 % Cr steel
  9. Superplasticity in a directionally solidified multiphase Ni-25Al-25Cr alloy
  10. Articles BBasic
  11. Assessment of thermodynamic parameters in the system ZrO2–Y2O3–Al2O3
  12. Assessment of the thermodynamics and phase diagram of the SrO–B2O3 system
  13. Thermodynamic description of the Au–Al system
  14. Chemical reaction and stability of Ti3SiC2 in Cu during high-temperature processing of Cu/Ti3SiC2 composites
  15. Precipitation behavior of an Fe-1.03 wt.% Cu alloy
  16. Instructions to Authors/Richtlinien für Autoren
  17. Instructions for Authors
  18. Notifications/Mitteilungen
  19. Personal/Personelles
  20. Press/Presse
  21. Books/Bücher
  22. Events/Veranstaltungen
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