Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates
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Y. C. Chan
Abstract
The efforts of this study aim to investigate the morphology and growth kinetics of the intermetallic compounds formed during the interfacial reactions of eutectic Sn–9Zn solders with Cu and Ni substrates at temperatures ranging from 250 to 350 °C. Experimental results show that the intermetallic growth rate at the Sn–9Zn/Cu interface is much higher than that at the Sn– 9Zn/Ni interface. Kinetics analyses indicate that both types of interfacial reactions are diffusion-controlled. The activation energies for the intermetallic growth at the Sn–9Zn/Cu and Sn– 9Zn/Ni interfaces are 8.2 and 68.9 kJ/mol, respectively. The formation mechanisms of the intermetallic compounds during the soldering reactions at both interfaces are clarified by using a Ta thin film as diffusion marker.
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© 2002 Carl Hanser Verlag, München
Artikel in diesem Heft
- Frontmatter
- Articles/Aufsätze
- Phosphorus grain boundary diffusion and segregation in Fe–2.2 wt.% Si alloy
- Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates
- Thermal fatigue resistance in Pb-based solder alloys for electronic packaging
- Rolling and recrystallization textures in Al –Mg alloys
- Structures similar to a quasicrystal in technical aluminum alloys
- Processing map for hot working of hot rolled Mg– 11.5Li –1.5Al alloy
- Applications of computational thermodynamics
- Phase diagram of the Fe –Co –R system with R ⩽33.3 at.% Sm0.5Nd0.5
- Microstresses caused by uniaxial deformation and by mechanical surface treatments
- The influence of basic vs. rutile electrode on the composition of duplex stainless steel weldments
- Mixed mode I/III fracture toughness of Armco iron at 77 K
- Suitability assessment of replacement of conventional hot-working steels with maraging steel
- Suitability assessment of replacement of conventional hot-working steels with maraging steel
- Notifications/Mitteilungen
- Personal/Personelles
- Conferences/Tagungen
Artikel in diesem Heft
- Frontmatter
- Articles/Aufsätze
- Phosphorus grain boundary diffusion and segregation in Fe–2.2 wt.% Si alloy
- Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates
- Thermal fatigue resistance in Pb-based solder alloys for electronic packaging
- Rolling and recrystallization textures in Al –Mg alloys
- Structures similar to a quasicrystal in technical aluminum alloys
- Processing map for hot working of hot rolled Mg– 11.5Li –1.5Al alloy
- Applications of computational thermodynamics
- Phase diagram of the Fe –Co –R system with R ⩽33.3 at.% Sm0.5Nd0.5
- Microstresses caused by uniaxial deformation and by mechanical surface treatments
- The influence of basic vs. rutile electrode on the composition of duplex stainless steel weldments
- Mixed mode I/III fracture toughness of Armco iron at 77 K
- Suitability assessment of replacement of conventional hot-working steels with maraging steel
- Suitability assessment of replacement of conventional hot-working steels with maraging steel
- Notifications/Mitteilungen
- Personal/Personelles
- Conferences/Tagungen
