Analysis of the Residual Stresses in the Process of Nanoimprint Lithography
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W.-B. Young
Abstract
Nanoimprint lithography has attracted broad interest as a low cost method to define nanometer scale patterns in recent years. In the cooling stage of the nanoimprint lithography process, the polymer resist is constrained inside the tool. As the temperature decreases, the polymer may shrink away from the tool. However, due to the constraint of the tool, thermal stresses may be induced in the polymer while the relaxation effect tends to release the build up of the stress level at the same time. In this study, a visco-elastic model was developed to analyze the stress variations of the imprinted patterns during the cooling process. Most of the residual stress is found to concentrate on the interface between the polymer resist and the substrate. Also, some stress concentration areas are observed near the adjacent of the large un-patterned area and the pillar. Thermal stress above the glass transition point is demonstrated to be able to relax during the cooling process. Most of the residual stresses are induced at the cooling stage with a temperature lower than the glass transition point.
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© 2006, Hanser Publishers, Munich
Articles in the same Issue
- Contents
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- Regular Contributed Articles
- New Multicomponent Compatibilization System for Polyolefin/Polystyrene Blends
- Preparation and Characterization of HMW PA 6 via Anionic Polymerization of ∊-Caprolactam by Using a Mixture of Di- and Tri-functional Chain Initiators
- Polymer Processing Extrusion Instabilities and Methods for their Elimination or Minimisation
- Microcellular Wood Fibre Reinforced PP Composites
- Effects of Take-up Speed of Melt Spinning on the Structure and Mechanical Propertiesof Maximally Laser Drawn PA9-T Fibers
- Description of the Pressure/Throughput Behavior of a Single-screw Plasticating Unit in Consideration of Wall Slippage Effects for Non-Newtonian Material and 1-D flow
- Study of Starch Gelatinization in a Flow Field Using Simultaneous Rheometric Data Collection and Microscopic Observation
- Analysis of the Residual Stresses in the Process of Nanoimprint Lithography
- The Reactive Extrusion of Thermoplastic Polyurethane and the Effect of the Depolymerization Reaction
- Simulation of Core Deflection in Powder Injection Molding
- Experimental Investigation of the Cooling Flow in the Film Blowing Process
- Study of the Compatibilizer Effect on Blends Prepared from Waste Poly(ethylene-terephthalate) and High Density Polyethylene
- PPS News
- PPS News
- Seikei-Kakou Abstracts
- Seikei-Kakou Abstracts
Articles in the same Issue
- Contents
- Contents
- Regular Contributed Articles
- New Multicomponent Compatibilization System for Polyolefin/Polystyrene Blends
- Preparation and Characterization of HMW PA 6 via Anionic Polymerization of ∊-Caprolactam by Using a Mixture of Di- and Tri-functional Chain Initiators
- Polymer Processing Extrusion Instabilities and Methods for their Elimination or Minimisation
- Microcellular Wood Fibre Reinforced PP Composites
- Effects of Take-up Speed of Melt Spinning on the Structure and Mechanical Propertiesof Maximally Laser Drawn PA9-T Fibers
- Description of the Pressure/Throughput Behavior of a Single-screw Plasticating Unit in Consideration of Wall Slippage Effects for Non-Newtonian Material and 1-D flow
- Study of Starch Gelatinization in a Flow Field Using Simultaneous Rheometric Data Collection and Microscopic Observation
- Analysis of the Residual Stresses in the Process of Nanoimprint Lithography
- The Reactive Extrusion of Thermoplastic Polyurethane and the Effect of the Depolymerization Reaction
- Simulation of Core Deflection in Powder Injection Molding
- Experimental Investigation of the Cooling Flow in the Film Blowing Process
- Study of the Compatibilizer Effect on Blends Prepared from Waste Poly(ethylene-terephthalate) and High Density Polyethylene
- PPS News
- PPS News
- Seikei-Kakou Abstracts
- Seikei-Kakou Abstracts
