Startseite Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler
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Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler

  • Lung-Chuan Tsao , Ming-Jer Hsieh , Ting-Yu Chen , Shih-Ying Cheng und Chih-Wei Chen
Veröffentlicht/Copyright: 5. September 2016
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Abstract

In this work, 6061–Al alloy–graphite (Al–Gr) composites were fabricated via the squeeze casting method. Al/Al–Gr joints were formed by direct active soldering with Sn3.5Ag4Ti0.5Cu active filler. The joint microstructures were examined using optical microscopy and scanning electron microscopy coupled with energy dispersive spectrometry. The Sn3.5Ag4Ti0.5Cu active filler can successfully join Al–Gr composite to 6061–Al alloy at a temperature of 250°C. During direct active soldering, Al dissolves into the active filler zone to form a coarse Al–Ag–Sn solid solution around the active filler. The shear-tested bonding strengths were 14.30 ± 1.57 MPa for Al/Al, 8.45 ± 1.37 MPa for Al–Gr/Al, and 8.15 ± 1.43 MPa for Al–Gr/Al–Gr joints. In the Al/Al–Gr joints, the fractures occurred through the active filler/Al–Gr interface.


*Correspondence address, Prof. Dr. Lung-Chuan Tsao, Department of Materials Engineering, National Pingtung University of Science & Technology, 1, Hseuhfu Road, Neipu, Pingtung, 91201, Taiwan, Tel.: +88 687703202 ext. 7560, Fax: +88 687740552, E-mail: , Web: http://mse.npust.edu.tw/files/11-1027-3185.php?Lang=zh-tw

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Received: 2016-03-06
Accepted: 2016-06-01
Published Online: 2016-09-05
Published in Print: 2016-09-15

© 2016, Carl Hanser Verlag, München

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