Recovery stress and shape memory stability in Ni–Ti–Cu thin wires at high temperatures

Articles in the same Issue

1. Contents
2. Contents
3. Editorial
4. Changes in the Editorial Office of IJMR
5. Original Contributions
6. Influence of the nature of an electric field applied during the solution heat treatment of the Al-Mg-Si-Cu Alloy AA6111 on subsequent natural aging
7. Isothermal dynamic thermal diffusivity studies of the reduction of NiO and NiWO₄ precursors by hydrogen
8. Heating rate effects on reverse martensitic transformation in a Cu – Zn – Al shape memory alloy
9. Effect of Ce content on the microstructure of semisolid Mg-10Al alloy
10. Dielectric properties of low-temperature sintered Ba(Fe_0.5Nb_0.5)O₃ with BaCu(B₂O₅) addition
11. Recovery stress and shape memory stability in Ni–Ti–Cu thin wires at high temperatures
12. Microstructure and mechanical properties of WC-Ni-Al based cemented carbides developed for engineering applications
13. Microstructure of austenitic stainless steels of various phase stabilities after cyclic and tensile deformation
14. High temperature workability behaviour of a modified P92 steel
15. Influence of mineralized collagen fibrils on the thermo-sensitivity of an injectable scaffold for bone regeneration
16. Low temperature synthesis of CuGeO₃ nanoflowers from n-heptane solvent
17. Preparation of Zn_1–xMn_xO nanoparticles by a simple “green” method and photocatalytic activity under visible light irradiation
18. Surface morphology, electrical and optical properties n-type doped MOCVD grown GaSb using dimethyltellurium
19. The role of polymethylhydrosiloxane in the sol-gel synthesis of high surface area porous silicon carbide
20. Synthesis, characterization and dehydration–rehydration study of sol-gel derived hydroxide hydrogel of the MgO–ZrO₂ system
21. DGM News
22. DGM News