Home Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Article
Licensed
Unlicensed Requires Authentication

Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

  • Megan J. Cordill , Aidan Taylor , Johannes Schalko and Gerhard Dehm
Published/Copyright: June 11, 2013
Become an author with De Gruyter Brill
Author Information
International Journal of Materials Research
From the journal International Journal of Materials Research Volume 102 Issue 6

Abstract

The ability to measure the adhesion energy of metal thin films on polymer substrates is important for the design of reliable flexible electronic devices. One technique is to create well-defined areas of delamination (buckles) as a consequence of lateral compressive stresses induced by tensile straining of the film–substrate system. The adhesion energy is calculated from the buckle dimensions. In order to improve the adhesion between the metal film and polymer substrate, thin adhesion layers can be incorporated. However, interdiffusion and reactions can occur between the adhesion layer and the metal film when subjected to elevated temperatures. This is detrimental for the interfacial adhesion, as will be discussed for Cu films on polyimide with a Ti interlayer subjected to annealing at 350°C.

Keywords: Thin films; Adhesion; TEM; Diffusion; Polymer substrates
* Correspondence address, Dr. Megan J. Cordill Dept. Materials Physics, Montanuniversität Leoben Jahnstrasse 12, 8700 Leoben, Austria Tel.: +43 3842 804 323 Fax: +43 3842 804 116 E-mail:

Dedicated to Prof. F. D. Fischer on the occasion of his 70th birthday

References

[1] V.J.Lumelsky, M.S.Shur, S.Wagner: IEEE Sensors J.1 (2001) 41.10.1109/JSEN.2001.923586Search in Google Scholar

[2] S.Wagner, E.Bonderover, W.B.Jordan, J.C.Sturm: Int. J. High Speed Electron. Syst.12 (2002) 1.10.1142/S0129156402001186Search in Google Scholar

[3] C.J.Brabec, N.S.Sariciftic, J.C.Hummelen: Adv. Functional Mater.11 (2001) 15.10.1002/1616-3028(200102)11:1<15::AID-ADFM15>3.0.CO;2-ASearch in Google Scholar

[4] M.J.Cordill: JOM62 (2010) 9.10.1007/s11837-010-0096-5Search in Google Scholar

[5] Y.Xiang, T.Li, Z.Suo, J.J.Vlassak: Appl. Phys. Lett.87 (2005) 161910–1.10.1063/1.2108110Search in Google Scholar

[6] T.Li, Z.Huang, Z.C.Xi, S.P.Lacour, S.Wagner, Z.Suo: Mech. Mater.37 (2005) 261.10.1016/j.mechmat.2004.02.002Search in Google Scholar

[7] T.Li, Z.Hunag, Z.Suo, S.P.Lacour, S.Wagner: Appl. Phys. Lett.85 (2004) 3435.10.1063/1.1806275Search in Google Scholar

[8] M.George, C.Coupeau, J.Colin, J.Grilhe: Acta Mater.53 (2005) 411.10.1016/j.actamat.2004.09.036Search in Google Scholar

[9] M.J.Cordill, N.R.Moody, D.F.Bahr: J. Mater. Res.19 (2004) 1818.10.1557/JMR.2004.0232Search in Google Scholar

[10] N.Lu, X.Wang, Z.Suo, J.Vlassak: J. Mater. Res.24 (2009) 379.10.1557/jmr.2009.0048Search in Google Scholar

[11] N.Lu, Z.Suo, J.J.Vlassak: Acta Mater.58 (2010) 1679.10.1016/j.actamat.2009.11.010Search in Google Scholar

[12] M.J.Cordill, F.D.Fischer, F.G.Rammerstorfer, G.Dehm: Acta Mater.58 (2010) 5520.10.1016/j.actamat.2010.06.032Search in Google Scholar

[13] J.W.Hutchinson, Z.Suo: Adv. Appl. Mech.29 (1992) 63.10.1016/S0065-2156(08)70164-9Search in Google Scholar

[14] B.Audoly: Phys. Rev. Lett.83 (1999) 4124.10.1103/PhysRevLett.83.4124Search in Google Scholar

[15] A.Strecker, U.Salzberger, J.Mayer: Praktishe Metallographie30 (1993) 482.Search in Google Scholar

[16] Y.Iijima, K.Hoshino, K-I.Hirano: Metall. Trans. A8 (1977) 997.10.1007/BF02661585Search in Google Scholar

[17] S.Baunack, S.Menzel, M.Pekarcikova, H.Schmidt, M.Albert, K.Wetzig: Anal. Bioanal. Chem.375 (2003) 891. PMid:12707756Search in Google Scholar

[18] O.Taguchi, Y.Iijima: Phil. Mag. A72 (1995) 1649.10.1080/01418619508243935Search in Google Scholar

[19] D.Shechtman, D.van Heerden, D.Josell: Mater. Lett.20 (1994) 329.10.1016/0167-577X(94)90039-6Search in Google Scholar

[20] PDF 2 database, Pattern 18-459 and 20-370.Search in Google Scholar

[21] G.Dehm. C.Scheu, M.Rühle, R.Raj: Acta Mater.46 (1998) 759.10.1016/S1359-6454(97)00257-7Search in Google Scholar

[22] J.B.Lai, L.J.Chen, S.C.Liu: Micron30 (1999) 205.10.1016/S0968-4328(99)00006-2Search in Google Scholar

[23] H.Okamoto: J. Phase Equilibria26 (2002) 549.10.1361/105497102770331307Search in Google Scholar

[24] D.C.Agrawal, R.Raj: Acta Metall.37 (1989) 1265.10.1016/0001-6160(89)90120-XSearch in Google Scholar

[25] M.J.Cordill, F.D.Fischer, K.Schmidegg, G.Dehm: in preparation.Search in Google Scholar

Received: 2010-12-17
Accepted: 2011-3-17
Published Online: 2013-06-11
Published in Print: 2011-06-01

© 2011, Carl Hanser Verlag, München

Articles in the same Issue

  1. Original Contributions
  2. Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
  3. On the origin of inhomogeneous stress and strain distributions in single-crystalline metallic nanoparticles
  4. Contents
  5. Contents
  6. Editorial
  7. Editorial June 2011
  8. IJMR's most downloaded papers
  9. Original Contributions
  10. An excursion into the design space of biomimetic architectured biphasic actuators
  11. Strategies for fracture toughness, strength and reliability optimisation of ceramic-ceramic laminates
  12. Fracture statistics of brittle materials at micro- and nano-scales
  13. Martensitic phase transformations of nanocrystalline NiTi shape memory alloys processed by repeated cold rolling
  14. Variational modeling of shape memory alloys – an overview
  15. Phase-field approach to martensitic phase transformations: Effect of martensite–martensite interface energy
  16. Modelling of diffusive and massive phase transformations in binary systems – thick interface parametric model
  17. On the strength of grain and phase boundaries in ferritic-martensitic dual-phase steels
  18. A micro-level strain analysis of a high-strength dual-phase steel
  19. Thermodynamic description of niobium-rich γ-TiAl alloys
  20. Phase transition and ordering behavior of ternary Ti–Al–Mo alloys using in-situ neutron diffraction
  21. Microstructure evolution and mechanical properties of an intermetallic Ti-43.5Al-4Nb-1Mo-0.1B alloy after ageing below the eutectoid temperature
  22. Investigation of Cu precipitation in bcc-Fe – Comparison of numerical analysis with experiment
  23. Modeling interfacial effects on the thermal conduction behavior of short fiber reinforced composites
  24. Electronic origin of structure and mechanical properties in Y and Nb alloyed Ti–Al–N thin films
  25. DGM News
  26. DGM News
https://doi.org/10.3139/146.110513
Keywords for this article
Thin films; Adhesion; TEM; Diffusion; Polymer substrates

Articles in the same Issue

  1. Original Contributions
  2. Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
  3. On the origin of inhomogeneous stress and strain distributions in single-crystalline metallic nanoparticles
  4. Contents
  5. Contents
  6. Editorial
  7. Editorial June 2011
  8. IJMR's most downloaded papers
  9. Original Contributions
  10. An excursion into the design space of biomimetic architectured biphasic actuators
  11. Strategies for fracture toughness, strength and reliability optimisation of ceramic-ceramic laminates
  12. Fracture statistics of brittle materials at micro- and nano-scales
  13. Martensitic phase transformations of nanocrystalline NiTi shape memory alloys processed by repeated cold rolling
  14. Variational modeling of shape memory alloys – an overview
  15. Phase-field approach to martensitic phase transformations: Effect of martensite–martensite interface energy
  16. Modelling of diffusive and massive phase transformations in binary systems – thick interface parametric model
  17. On the strength of grain and phase boundaries in ferritic-martensitic dual-phase steels
  18. A micro-level strain analysis of a high-strength dual-phase steel
  19. Thermodynamic description of niobium-rich γ-TiAl alloys
  20. Phase transition and ordering behavior of ternary Ti–Al–Mo alloys using in-situ neutron diffraction
  21. Microstructure evolution and mechanical properties of an intermetallic Ti-43.5Al-4Nb-1Mo-0.1B alloy after ageing below the eutectoid temperature
  22. Investigation of Cu precipitation in bcc-Fe – Comparison of numerical analysis with experiment
  23. Modeling interfacial effects on the thermal conduction behavior of short fiber reinforced composites
  24. Electronic origin of structure and mechanical properties in Y and Nb alloyed Ti–Al–N thin films
  25. DGM News
  26. DGM News
Sign up now to receive a 20% welcome discount
Institutional Access
How does access work?
Have an idea on how to improve our website?
Please write us.
© 2025 De Gruyter Brill
Downloaded on 2.10.2025 from https://www.degruyterbrill.com/document/doi/10.3139/146.110513/html?lang=en
Scroll to top button