Microstructural analysis in the vacuum brazing of copper to copper using a phosphor–copper brazing filler metal
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P. L. Zhang
, S. Yao , M. Ding , F. G. Lu and S. N. Lou
Abstract
Brazing of copper to copper using phosphor–copper brazing filler metal has been carried out using vacuum brazing technology. The wettability, melting performance, microstructure and phase constitution in the joint were studied by means of differential thermal analysis, metallography, energy dispersive X-ray detector and X-ray diffraction. Experimental results obtained showed that the structure in the joint consisted of hypoeutectic alloy. The primary phase is copper solid solution (α(Cu)) and silver solid solution (α(Ag)). The eutectic phase is copper solid solution (α(Cu)), silver solid solution (α(Ag)) and Cu3P. The optimum process parameters are: brazing temperature T = 820–850°C, vacuum level p = 10−3 Pa, holding time t = 5–10 min.
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© 2010, Carl Hanser Verlag, München
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Articles in the same Issue
- Contents
- Contents
- Editorial
- 2nd Sino-German Symposium on Computational Thermodynamics and Kinetics and their Applications to Solidification
- Basic
- Multiscale simulations on the grain growth process in nanostructured materials
- Thermodynamic re-modeling of the Co–Gd system
- Microstructure and tribological properties of in-situ Y2O3/Ti-5Si alloy composites
- Phase relations in the ZrO2–Nd2O3–Y2O3 system: experimental study and CALPHAD assessment
- Phase transition in nanocrystalline iron: Atomistic-level simulations
- Thermodynamic assessment of the Cr–Al–Nb system
- Experimental investigation and thermodynamic modeling of the Cu–Mn–Zn system
- Elastic constants and thermophysical properties of Al–Mg–Si alloys from first-principles calculations
- Predicting microsegregation in multicomponent aluminum alloys – progress in thermodynamic consistency
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- A thermodynamic description of the Ce–La–Mg system
- Molar volume calculation of Ga–Bi–X (X=Sn, In) liquid alloys using the general solution model
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