Numerical Simulation of Compression Molding of UHMWPE: Part II. Residual Stress Model

N. C. Parasnis; K. Ramani

doi:10.1515/ipp-2000-0011

Article

Numerical Simulation of Compression Molding of UHMWPE

Part II. Residual Stress Model

N. C. Parasnis and K. Ramani

Published/Copyright: February 23, 2022

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From the journal International Polymer Processing Volume 15 Issue 2

Abstract

In part I of this paper a thermal model was used for temperature predictions within a compression molded disc. A process simulated laminate technique was used to measure residual stresses. The fast cooling cycle produced high residual stresses (∼10 MPa). The slow cooling cycle produced low residual stresses (∼1 MPa). The cycle with soak at crystallization also produced low residual stresses (∼2.6 MPa). The modeled and measured values were in close agreement. A major portion of the residual stresses (∼70 %) was developed within a short time period (∼10 min) after the end of crystallization for all the cycles.

* Mail address: Dr. K. Ramani, Composites and Polymer Processing Lab., Room 308, School of Mechanical Engineering, Purdue University, West Lafayette, IL 47907-1288, USA

References

1 Tanner, M.G., Whiteside, L.A., White, S.E.: Clinical Orthopaedics and Related Research 317, p. 83 (1995)Search in Google Scholar

2 Treuting, R.G., Read, W.T., Jr.: Journal of Applied Mechanics 22, p. 130 (1951)10.1063/1.1699913Search in Google Scholar

3 So, P., Broutman, L.J.: Polym. Eng. Sci. 16, p. 785 (1976)10.1002/pen.760161202Search in Google Scholar

4 White, J.R.: Journal of Materials Science 20, p. 2377 (1985)10.1007/BF00556067Search in Google Scholar

5 Haworth, B., Hindle, C.S., Sandilands, G.J., White, J.R.: Plastics and Rubber Processing and Applications 2, p. 59 (1982)Search in Google Scholar

6 Maneschy, C.E., Miyano, Y., Shimbo, M., Woo, T.C.: Experimental Mechanics 26, p. 306 (1986)10.1007/BF02320143Search in Google Scholar

7 White, S.R., Hahn, H.T.: Journal of Composite Materials 26, p. 2402 (1992)10.1177/002199839202601604Search in Google Scholar

8 White, S.R., Hahn, H.T.: Journal of Composite Materials 26, p. 2423 (1992)10.1177/002199839202601605Search in Google Scholar

9 Ramani, K., Zhao, W.: International Journal of Adhesion and Adhesives 17, p. 353 (1997)10.1016/S0143-7496(97)00030-4Search in Google Scholar

10 Eduljee, R.F., Gillespie, J.W., Jr., McCullough, R.L.: Polym. Eng. Sci. 34, p. 500 (1994)10.1002/pen.760340607Search in Google Scholar

11 Eduljee, R.F., Gillespie, J.W., Jr., McCullough, R.L.: Journal of Thermoplastic Composite Materials 2, p. 319 (1989)10.1177/089270578900200406Search in Google Scholar

12 Indenbohm, V.L.: Journal of Technical Physics 18, p. 925 (1954)Search in Google Scholar

13 Manson, J.-A.E., Seferis, J.C.: SPE Antec Tech. Papers 33, p. 1446 (1987)Search in Google Scholar

14 Manson, J.-A.E., Seferis, J.C.: Journal of Composite Materials 26, p. 405 (1992)10.1177/002199839202600305Search in Google Scholar

15 Miller, K.A., Ramani, K.: Polym. Eng. Sci. 39, p. 110 (1999)10.1002/pen.11401Search in Google Scholar

16 Davis, G.T., Eby, R.K.: Journal of Applied Physics 44, p. 4274 (1973)10.1063/1.1661951Search in Google Scholar

Received: 1998-07-30

Accepted: 2000-01-11

Published Online: 2022-02-23

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