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Fast penetration of Ga in Al: liquid metal embrittlement near the threshold of grain boundary wetting

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Published/Copyright: February 3, 2022
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 96 Issue 10

Abstract

The thermodynamic conditions for spontaneous grain boundary wetting and stress driven liquid metal embrittlement are related to each other and the kinetic mechanism responsible for fast GB penetration under small stress is described. The dissolution – condensation mechanism of liquid metal embrittlement and linear fracture mechanics for calculation of a crack profile are applied to the classical system “Al – liquid Ga”. The results tend to support the idea that the recently observed fast linear penetration of Ga along 150° tilt <110> GB of Al should be considered as propagation of a liquid metal embrittlement crack under a small residual stress rather than as spontaneous grain boundary wetting. With the residual tensile stress σ ≈ 0.5 MPa acting normal to the GB plane, all major findings reported for this model system are explained in a semiquantitative way assuming that the GB spreading coefficient is extremely small by its absolute value, i. e. that the system is near the threshold of spontaneous grain boundary wetting.

Keywords: Grain boundary wetting; Liquid metal embrittlement; Dissolution Condensation Mechanism; Al –Ga system; Residual stress
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  1. 1

    Note that Eq. (5) is Eq. (14) from [6] in which we have used the notations h and H instead of δGB and δ, respectively, just to avoid confusion in the use of the two δ-notations.

Received: 2005-06-20
Accepted: 2005-07-11
Published Online: 2022-02-03

© 2005 Carl Hanser Verlag, München

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles Basic
  5. Thermodynamics of grain boundary adsorption in binary systems with limited solubility
  6. Microstructural characteristics of 3-d networks
  7. On the three-dimensional twin-limited microstructure
  8. Grain growth kinetics in 2D polycrystals: impact of triple junctions
  9. Thermal stability of polycrystalline nanowires
  10. Conservative motion of parent-martensite interfaces
  11. Enthalpy – entropy compensation effect in grain boundary phenomena
  12. Thermodynamic stabilization of nanocrystallinity
  13. On the relation between the anisotropies of grain boundary segregation and grain boundary energy
  14. Influence of faceting-roughening on triple-junction migration in zinc
  15. The influence of triple junction kinetics on the evolution of polycrystalline materials during normal grain growth: New evidence from in-situ experiments using columnar Al foil
  16. Grain boundary dynamics and selective grain growth in non-ferromagnetic metals in high magnetic fields
  17. Grain boundary mobility under a stored-energy driving force: a comparison to curvature-driven boundary migration
  18. Diffusional behavior of nanoscale lead inclusions in crystalline aluminum
  19. Quantitative experiments on the transition between linear to non-linear segregation of Ag in Cu bicrystals studied by radiotracer grain boundary diffusion
  20. Room-temperature grain boundary diffusion data measured from historical artifacts
  21. Solid state infiltration of porous steel with aluminium by the forcefill process
  22. A mechanism of plane matching boundary-assisted α/γ phase transformation in Fe–Cr alloy based on in-situ observations
  23. Fast penetration of Ga in Al: liquid metal embrittlement near the threshold of grain boundary wetting
  24. High-pressure effect on grain boundary wetting in aluminium bicrystals
  25. Grain boundary segregation and fracture
  26. Notifications/Mitteilungen
  27. Personal/Personelles
  28. Press/Presse
  29. Conferences/Konferenzen
https://doi.org/10.1515/ijmr-2005-0207
Keywords for this article
Grain boundary wetting; Liquid metal embrittlement; Dissolution Condensation Mechanism; Al –Ga system; Residual stress

Articles in the same Issue

  1. Frontmatter
  2. Editorial
  3. Editorial
  4. Articles Basic
  5. Thermodynamics of grain boundary adsorption in binary systems with limited solubility
  6. Microstructural characteristics of 3-d networks
  7. On the three-dimensional twin-limited microstructure
  8. Grain growth kinetics in 2D polycrystals: impact of triple junctions
  9. Thermal stability of polycrystalline nanowires
  10. Conservative motion of parent-martensite interfaces
  11. Enthalpy – entropy compensation effect in grain boundary phenomena
  12. Thermodynamic stabilization of nanocrystallinity
  13. On the relation between the anisotropies of grain boundary segregation and grain boundary energy
  14. Influence of faceting-roughening on triple-junction migration in zinc
  15. The influence of triple junction kinetics on the evolution of polycrystalline materials during normal grain growth: New evidence from in-situ experiments using columnar Al foil
  16. Grain boundary dynamics and selective grain growth in non-ferromagnetic metals in high magnetic fields
  17. Grain boundary mobility under a stored-energy driving force: a comparison to curvature-driven boundary migration
  18. Diffusional behavior of nanoscale lead inclusions in crystalline aluminum
  19. Quantitative experiments on the transition between linear to non-linear segregation of Ag in Cu bicrystals studied by radiotracer grain boundary diffusion
  20. Room-temperature grain boundary diffusion data measured from historical artifacts
  21. Solid state infiltration of porous steel with aluminium by the forcefill process
  22. A mechanism of plane matching boundary-assisted α/γ phase transformation in Fe–Cr alloy based on in-situ observations
  23. Fast penetration of Ga in Al: liquid metal embrittlement near the threshold of grain boundary wetting
  24. High-pressure effect on grain boundary wetting in aluminium bicrystals
  25. Grain boundary segregation and fracture
  26. Notifications/Mitteilungen
  27. Personal/Personelles
  28. Press/Presse
  29. Conferences/Konferenzen
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