Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
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M. J. Chiang
Abstract
The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225–325 °C. The results indicate that the intermetallic compound Ag2+x(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified.
We are grateful to the National Science Council (NSC), Taiwan, for sponsoring this research under Grant No. NSC-90-2216-E002-032.
References
1 Kang, S.; Sarkhel, A.: J. Electron. Mat. 23 (1994) 701.10.1007/BF02651362Search in Google Scholar
2 Tomlinson, W.J.; Fullylove, A.: J. Mat. Sci. 27 (1992) 5777.10.1007/BF01119737Search in Google Scholar
3 Choi, W.K.; Lee, H.M.: J. Electron. Mat. 29 (2000) 1207.10.1007/s11664-000-0014-7Search in Google Scholar
4 Mei, Z.; Morris, J.W.: J. Electron. Mat. 21 (1992) 401.10.1007/BF02660403Search in Google Scholar
5 Mei, Z.; Morris, J.W.: J. Electron. Mat. 21 (1992) 599.10.1007/BF02655427Search in Google Scholar
6 Jacobson, D.M.; Humpston, D.: Gold Bull. 22 (1989) 910.1007/BF03214704Search in Google Scholar
7 Glazer, J.: Int. Mat. Rev. 40 (1995) 65.10.1179/imr.1995.40.2.65Search in Google Scholar
8 Liu, Y.M.; Chen, Y.L.; Chuang, T.H.: J. Electron. Mat. 29 (2000) 1047.10.1007/s11664-000-0171-8Search in Google Scholar
9 Liu, Y.M.; Chuang, T.H.: J. Electron. Mat. 29 (2000) 1328.10.1007/s11664-000-0133-1Search in Google Scholar
10 Huang, Y.T.; Chuang, T.H.: Z. Metallkd. 12 (2000) 1002.10.1515/ijmr-2000-911207Search in Google Scholar
11 Chuang, T.H.; Huang, Y.T.; Tsao, L.C.: J. Electron. Mat. 30 (2001) 945.10.1007/BF02657715Search in Google Scholar
12 Su, T.L.; Tsao, L.C.; Chang, S.Y; Chuang, T.H.: J. Mat. Eng. Perform, in press.Search in Google Scholar
13 Liu, P.L.; Shang, J.K.: J. Electron. Mat. 29 (2000) 622.10.1007/s11664-000-0056-xSearch in Google Scholar
14 Anthony, T.R.; Turnbull, D.: Phys. Rev. 151 (1966) 495.10.1103/PhysRev.151.495Search in Google Scholar
15 Dyson, B.F.: J. Appl. Phys. 37 (1966) 2375.10.1063/1.1708821Search in Google Scholar
© 2002 Carl Hanser Verlag, München
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- Notifications/Mitteilungen
- Personal/Personelles
- Information
- Conferences/Konferenzen
Articles in the same Issue
- Frontmatter
- Articles/Aufsätze
- Niobium bulk and grain boundary diffusion in alpha-iron
- Comparison of fatigue lives between grain boundaries and component single crystals of copper bicrystals
- Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
- Modelling the continuous cooling transformation diagram of engineering steels using neural networks
- Modelling the continuous cooling transformation diagram of engineering steels using neural networks
- Characterization of the metastable austenite in low-alloy FeCMnSi TRIP-aided steel by neutron diffraction
- Self-organized criticality – a model for recrystallization?
- Strain softening effects in texture and microstructure of torsioned pre-deformed Al rods
- Microstructural evolution in as-cast hypereutectic Al-Si alloys with different La additions
- Wear behaviour of graphitic aluminium composite sliding under dry conditions
- Temperature dependence of Young’s Modulus of alumina short fiber reinforced Zn–Al MMCs produced by pressure die-casting
- Notifications/Mitteilungen
- Personal/Personelles
- Information
- Conferences/Konferenzen
