Startseite Naturwissenschaften Predicting the surface waviness of sheet moulding compound parts by simulating process-induced thermal stresses
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Predicting the surface waviness of sheet moulding compound parts by simulating process-induced thermal stresses

  • Walter Michaeli und Christoph Kremer EMAIL logo
Veröffentlicht/Copyright: 1. Dezember 2011
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Journal of Polymer Engineering
Aus der Zeitschrift Band 31 Heft 8-9

Abstract

This paper describes an opportunity to compute the surface waviness of compression moulded sheet moulding compound (SMC) parts by simulating residual stresses. First, different types of surface defects occurring on SMC parts are discussed. A method for calculating the surface waviness of the compression moulded part is presented, which combines the simulation of the production process and the structural computation. Modelling of the curing reaction and the development of mechanical properties are discussed and implemented. The potential of the computation method is shown for an automotive fender made of SMC. The results state that the curing reaction of SMC can be well described using the approach of Ng and Manas-Zloczower. The position of the measured waviness on the examined fender is in good agreement with the calculated stress distribution.


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Published Online: 2011-12-01
Published in Print: 2011-12-01

©2011 by Walter de Gruyter Berlin Boston

Heruntergeladen am 13.3.2026 von https://www.degruyterbrill.com/document/doi/10.1515/POLYENG.2011.098/html?lang=de
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