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Steady State Creep in Cu-Al Solid Solution Alloys at Intermediate Temperatures and Low Stresses

  • L. Kloc, , J. Fiala, and J. Cadek,
Published/Copyright: May 6, 2011

Published Online: 2011-05-06
Published in Print: 1993-01

©2011 by Walter de Gruyter GmbH & Co.

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