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The Adherence of Growing Copper and Iron Oxide Scales to Quartz Glass, Corundum and Platinum

  • Teodor Werber,
Published/Copyright: May 6, 2011
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High Temperature Materials and Processes
From the journal High Temperature Materials and Processes Volume 7 Issue 4

Published Online: 2011-05-06
Published in Print: 1987-09

©2011 by Walter de Gruyter GmbH & Co.

Articles in the same Issue

  1. CONTENTS
  2. The Role of Grain Size on the Tensile Properties of Cu-4.9 at. % Sn Between 500 and 700 Κ
  3. The Adherence of Growing Copper and Iron Oxide Scales to Quartz Glass, Corundum and Platinum
  4. Pyrometallurgy of Molybdenum
  5. Anomalous Creep Behaviour of Two Heats of Type 316 Stainless Steel at 823K
  6. BOOK REVIEWS
  7. INDEX - VOLUME 7
https://doi.org/10.1515/HTMP.1987.7.4.201
Creative Commons
BY-NC-ND 3.0

Articles in the same Issue

  1. CONTENTS
  2. The Role of Grain Size on the Tensile Properties of Cu-4.9 at. % Sn Between 500 and 700 Κ
  3. The Adherence of Growing Copper and Iron Oxide Scales to Quartz Glass, Corundum and Platinum
  4. Pyrometallurgy of Molybdenum
  5. Anomalous Creep Behaviour of Two Heats of Type 316 Stainless Steel at 823K
  6. BOOK REVIEWS
  7. INDEX - VOLUME 7
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