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System Architecture for Low Power 24 GHz Front-End
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Stefan von der Mark,
, Meik Huber, , Mathias Wittwer, , Wolfgang Heinrich, and Georg Boeck,
Published/Copyright:
March 1, 2004
Published Online: 2004-03
©2011 by Walter de Gruyter GmbH & Co.
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- Table of Contents
- Introduction to special issue Microsystem Technologies for Autarkic Distributed Microsystems in Sensor Networks
- The "e-Grain" Concept Building Blocks for Self-Sufficient Distributed Microsystems
- Design Aspects of Self-Sufficient Distributed MicroSystems
- Flexible Circuit Carrier with Integrated Passives for High Density Integration
- Ultra Thin Flip Chip Interconnects
- System Architecture for Low Power 24 GHz Front-End
- Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End
- Antenna Concepts for Ubiquitous Communication Networks: The Case of AVM
- Autonomous Energy Supply for Electronic Grains and Wireless Sensors
- A MAC Protocol for Wireless Sensor Networks with Multiple Selectable, Fixed-Orientation Antennas
- Distributed Middleware for Global Knowledge in Sensor Networks
- Demonstration of Autarkie Distributed Microsystems with Existing Hybrid Technologies
Articles in the same Issue
- Table of Contents
- Introduction to special issue Microsystem Technologies for Autarkic Distributed Microsystems in Sensor Networks
- The "e-Grain" Concept Building Blocks for Self-Sufficient Distributed Microsystems
- Design Aspects of Self-Sufficient Distributed MicroSystems
- Flexible Circuit Carrier with Integrated Passives for High Density Integration
- Ultra Thin Flip Chip Interconnects
- System Architecture for Low Power 24 GHz Front-End
- Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End
- Antenna Concepts for Ubiquitous Communication Networks: The Case of AVM
- Autonomous Energy Supply for Electronic Grains and Wireless Sensors
- A MAC Protocol for Wireless Sensor Networks with Multiple Selectable, Fixed-Orientation Antennas
- Distributed Middleware for Global Knowledge in Sensor Networks
- Demonstration of Autarkie Distributed Microsystems with Existing Hybrid Technologies