Ultra Thin Flip Chip Interconnects

Articles in the same Issue

1. Table of Contents
2. Introduction to special issue Microsystem Technologies for Autarkic Distributed Microsystems in Sensor Networks
3. The "e-Grain" Concept Building Blocks for Self-Sufficient Distributed Microsystems
4. Design Aspects of Self-Sufficient Distributed MicroSystems
5. Flexible Circuit Carrier with Integrated Passives for High Density Integration
6. Ultra Thin Flip Chip Interconnects
7. System Architecture for Low Power 24 GHz Front-End
8. Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End
9. Antenna Concepts for Ubiquitous Communication Networks: The Case of AVM
10. Autonomous Energy Supply for Electronic Grains and Wireless Sensors
11. A MAC Protocol for Wireless Sensor Networks with Multiple Selectable, Fixed-Orientation Antennas
12. Distributed Middleware for Global Knowledge in Sensor Networks
13. Demonstration of Autarkie Distributed Microsystems with Existing Hybrid Technologies