Optimal Shape Synthesis of Electric Devices using the Boundary Element Method

Chapters in this book

1. Frontmatter I
2. PREFACE V
3. CONTENTS VII
4. FIRST INTERNATIONAL CONFERENCE ON COMPUTATIONAL MODELLING OF FREE AND MOVING BOUNDARY PROBLEMS 91 IX
5. SECTION 1: SOLIDIFICATION AND MELTING
6. Recent Developments in the Modelling of Solidification Processes 3
7. Numerical Modelling of Freezing Processes in Foodstuffs 21
8. An Alternative Approach for the Modelling and Simulation of Binary-Alloy Solidification using a Fixed-Grid Control-Volume Technique 59
9. Melting of Anisotropic Crystals by the Boundary-Domain Integral Method 77
10. An Efficient Finite Element Procedure for the Solution of Enthalpy Model for Phase Change Heat Conduction Problems 93
11. Cyclic Phase Change Heat Conduction in T h i n Composite Slabs 105
12. Simulation of Natural Convection Melting of a Pure Metal from Below 121
13. A Fast Implementation of the Isotherm Migration Method 133
14. An Inverse Finite Element Method for Directly Formulated Free and Moving Boundary Problems 149
15. Finite Difference Enthalpy Methods for Dendritic Growth 165
16. Numerical Model of Heat Transfer Processes in Solidifying and Cooling Steel Ingot (on the basis of BEM) 177
17. SECTION 2: METAL CASTING AND WELDING
18. Spread in Hot Rolling: an Optimal Control Approach 193
19. Newtonian Fluid Computations in Lagrangian Variables with a Remeshing Technique. Application to the Filling Stage of the Diecasting Process 207
20. Utilization of the Boundary Element Method for Numerical Analysis of Thermal Processes in the Casting-Mould System 223
21. Free Surfaces Computation in a Steady-State Finite Element Model for Tube Rolling 239
22. Prediction of the Free Surface in a Continuous Casting Mould and its Influence on the Flow Pattern and the Temperature Distribution 253
23. SECTION 3: ELECTRICAL/ELECTROMAGNETIC PROBLEMS
24. Optimal Shape Synthesis of Electric Devices using the Boundary Element Method 269
25. Modelization of the Non-Linear Moving Parts of an Electromechanical Relay 281
26. SECTION 4: SCIENTIFIC APPLICATIONS
27. Moving Boundary Problems and Solution Strategies in Semiconductor Process Simulation 295
28. On a Kind of Dynamic Fracture Problem with Moving Boundaries 309
29. Backmatter 321