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Kinetics of growth of intermetallics in the Cu–Sn system

  • S. P. Gupta and D. Rathor
Published/Copyright: January 3, 2022
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Abstract

An investigation has been carried out to study the kinetics of growth of the intermetallics in the Cu–Sn system. The diffusion couples of Cu and Sn were prepared and annealed in the temperature range 367 – 510 °C. The Cu3Sn and Cu4Sn intermetallics were observed to form at temperatures above the peritectic reaction isotherm at 415 °C. The Cu3Sn and Cu6Sn5 intermetallics formed in the diffusion couples below 415 °C. The growth distance of each intermetallic was measured as a function of time and temperature. The growth of the intermetallics follows the parabolic growth law. In general, the chemical diffusion of Sn in Cu has been observed to control the growth of the intermetallics. The diffusivity value is also close to the interdiffusion coefficient of Sn and Cu for the δ phase. The concentration –distance profile has clearly demonstrated the formation of these intermetallics in the diffusion couple experiment.


S. P. Gupta Departement of Meter. & Metall. Eng. Indian Institute of technology Kanpur 208016, India Tel.: +91 512 597 648 Fax: +91 512 597 505

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Received: 2001-05-31
Published Online: 2022-01-03

© 2002 Carl Hanser Verlag, München

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