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Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates

  • Y. C. Chan , M. Y. Chiu and T. H. Chuang EMAIL logo
Published/Copyright: December 27, 2021
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 93 Issue 2

Abstract

The efforts of this study aim to investigate the morphology and growth kinetics of the intermetallic compounds formed during the interfacial reactions of eutectic Sn–9Zn solders with Cu and Ni substrates at temperatures ranging from 250 to 350 °C. Experimental results show that the intermetallic growth rate at the Sn–9Zn/Cu interface is much higher than that at the Sn– 9Zn/Ni interface. Kinetics analyses indicate that both types of interfacial reactions are diffusion-controlled. The activation energies for the intermetallic growth at the Sn–9Zn/Cu and Sn– 9Zn/Ni interfaces are 8.2 and 68.9 kJ/mol, respectively. The formation mechanisms of the intermetallic compounds during the soldering reactions at both interfaces are clarified by using a Ta thin film as diffusion marker.

Keywords: Intermetallic compounds; Soldering reactions; Sn–9Zn/Cu; Sn– 9Zn/Ni
Prof. T. H. Chuang Department of Materials Science and Engineering National Taiwan University 1. Roosevelt Rd., Sec. 4, Taipei 106, Taiwan Tel.: +886 2 2392 9635 Fax: +886 2 2363 4562

References

1 Lee, N.C.: Adv. Microelectron. 26 (1999) 29.10.1016/S0026-2714(98)00159-0Search in Google Scholar

2 Tu, K.N.; Zeng, K.: Mater. Sci. Eng. R 34 (2001) 1.10.1016/S0927-796X(01)00029-8Search in Google Scholar

3 Mei, Z.; Morris, Jr. J.W.: J. Electron. Mater. 21 (1992) 599.10.1007/BF02655427Search in Google Scholar

4 Chada, S.; Fourmelle, R.A.; Laub, W.: J. Electron. Mater. 29 (2000) 1214.10.1007/s11664-000-0015-6Search in Google Scholar

5 Lee, Y.G.; Duh, J.G.: Mater. Characterization 42 (1999) 143.10.1016/S1044-5803(98)00059-XSearch in Google Scholar

6 Pan, T.Y.; Dlair, H.D.; Nicholson, J.M.; Oh, S.W.: Adv. Electron. Packaging 19 (1997) 1347.Search in Google Scholar

7 Chen, C.; Ho, C.E.; Lin, A.H.; Luo, G.L.; Kao, C.R.: J. Electron. Mater. 29 (2000) 1200.10.1007/s11664-000-0013-8Search in Google Scholar

8 Harris, P.: Soldering and Surf. Mount Technol. 11 (1999) 46.10.1108/09540919910293874Search in Google Scholar

9 Lee, H.M.; Yoon, S.W.; Lee, B.J.: J. Electron. Mater. 27 (1998) 1161.10.1007/s11664-998-0065-8Search in Google Scholar

10 Yoon, S.W.; Soh, J.R.; Lee, H.M.; Lee, B.J.: Acta Mater. 45 (1997) 951.10.1016/S1359-6454(96)00253-4Search in Google Scholar

11 Yoon, S.W.; Choi, W.K.; Lee, H.M.: Scripta Mater. 40 (1999) 327.10.1016/S1359-6462(98)00414-XSearch in Google Scholar

12 Suganuma, K.; Niihara, K.: J. Mater. Research 13 (1998) 2859.10.1557/JMR.1998.0391Search in Google Scholar
Received: 2001-11-06
Published Online: 2021-12-27

© 2002 Carl Hanser Verlag, München

Articles in the same Issue

  1. Frontmatter
  2. Articles/Aufsätze
  3. Phosphorus grain boundary diffusion and segregation in Fe–2.2 wt.% Si alloy
  4. Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates
  5. Thermal fatigue resistance in Pb-based solder alloys for electronic packaging
  6. Rolling and recrystallization textures in Al –Mg alloys
  7. Structures similar to a quasicrystal in technical aluminum alloys
  8. Processing map for hot working of hot rolled Mg– 11.5Li –1.5Al alloy
  9. Applications of computational thermodynamics
  10. Phase diagram of the Fe –Co –R system with R ⩽33.3 at.% Sm0.5Nd0.5
  11. Microstresses caused by uniaxial deformation and by mechanical surface treatments
  12. The influence of basic vs. rutile electrode on the composition of duplex stainless steel weldments
  13. Mixed mode I/III fracture toughness of Armco iron at 77 K
  14. Suitability assessment of replacement of conventional hot-working steels with maraging steel
  15. Suitability assessment of replacement of conventional hot-working steels with maraging steel
  16. Notifications/Mitteilungen
  17. Personal/Personelles
  18. Conferences/Tagungen
https://doi.org/10.3139/ijmr-2002-0021
Keywords for this article
Intermetallic compounds; Soldering reactions; Sn–9Zn/Cu; Sn– 9Zn/Ni

Articles in the same Issue

  1. Frontmatter
  2. Articles/Aufsätze
  3. Phosphorus grain boundary diffusion and segregation in Fe–2.2 wt.% Si alloy
  4. Intermetallic compounds formed during the soldering reactions of eutectic Sn–9Zn with Cu and Ni substrates
  5. Thermal fatigue resistance in Pb-based solder alloys for electronic packaging
  6. Rolling and recrystallization textures in Al –Mg alloys
  7. Structures similar to a quasicrystal in technical aluminum alloys
  8. Processing map for hot working of hot rolled Mg– 11.5Li –1.5Al alloy
  9. Applications of computational thermodynamics
  10. Phase diagram of the Fe –Co –R system with R ⩽33.3 at.% Sm0.5Nd0.5
  11. Microstresses caused by uniaxial deformation and by mechanical surface treatments
  12. The influence of basic vs. rutile electrode on the composition of duplex stainless steel weldments
  13. Mixed mode I/III fracture toughness of Armco iron at 77 K
  14. Suitability assessment of replacement of conventional hot-working steels with maraging steel
  15. Suitability assessment of replacement of conventional hot-working steels with maraging steel
  16. Notifications/Mitteilungen
  17. Personal/Personelles
  18. Conferences/Tagungen
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