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A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module

  • D. H. Jung , A. Sharma , M. Mayer and J. P. Jung EMAIL logo
Published/Copyright: March 28, 2019
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Received: 2018-08-23
Published Online: 2019-03-28
Published in Print: 2018-02-01

© 2019 D. H. Jung, et al., published by Sciendo

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