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The effect of pressure and temperature on microthermoforming thermoplastic films integrated in the injection moulding process

  • Ariane Jungmeier EMAIL logo
Published/Copyright: December 2, 2015
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Abstract

Injection moulding is a widespread large-scale production technology for the manufacturing of thermoplastic parts, with small wall thicknesses limiting the feasible flow length. Introducing microthermoforming into the injection moulding process with dynamic mould temperature control enables the production of film-based, plane microstructured parts with further three-dimensional functional structures (e.g. for handling or for fitting in devices/assembly groups). Investigations show that considerable forming is possible with pressures up to 140 bar and forming temperatures far below the glass transition temperature of 50-μm-thick polycarbonate films in cycle times of <3 min. Generally speaking, the novel technology is expected to allow for multifunctional, thin-walled microstructured parts at large scales with short cycle times.


Corresponding author: Ariane Jungmeier, Institute of Polymer Technology, Friedrich-Alexander-Universität Erlangen-Nürnberg, Am Weichselgarten 9, 91058 Erlangen-Tennenlohe, Germany, e-mail:

Acknowledgments

The author would like to thank the Deutsche Forschungsgemeinschaft (DFG) for funding the work in project JU 2944/1-1 as well as the head of the Institute of Polymer Technology Professor Dr.-Ing. Dietmar Drummer for enabling and supporting the work. The author also extends her gratitude to the industrial partners Werkzeugbau Siegfried Hofmann GmbH for supporting the mould design, HB-Therm AG for providing the dynamic oil-tempering equipment, and Bayer MaterialScience AG, Leonhard Kurz Stiftung & Co. KG, and Sabic Deutschland GmbH for providing the material. Furthermore, the author wishes to thank Arburg GmbH und Co. KG for supplying and optimising the injection moulding machine.

  1. Conflict of interest statement: The author declares that there is no financial or other substantive conflict of interest that might be construed to influence the results or their interpretation. All sources of financial support for the project are disclosed.

References

[1] Friebel D, Schnabel R. Microsystems Technology in Germany 2012, Trias Consult, Berlin, 2012, pp. 14–16.Search in Google Scholar

[2] Mehling M, Tay S. Curr. Opin. Biotechnol. 2014, 25, 95–102.10.1016/j.copbio.2013.10.005Search in Google Scholar

[3] Streets AM, Huang Y. Curr. Opin. Biotechnol. 2014, 25, 69–77.10.1016/j.copbio.2013.08.013Search in Google Scholar

[4] Underhill GH, Galie P, Chen CS, Bhatia SN. Annu. Rev. Cell Dev. Biol. 2012, 28, 385–410.10.1146/annurev-cellbio-101011-155709Search in Google Scholar

[5] Schwarzmann P. Thermoforming: A Practical Guide, Illig A, Ed., Hanser: Munich, 2001.Search in Google Scholar

[6] Throne JL. Understanding Thermoforming, Hanser: Munich, 2008.10.3139/9783446418554Search in Google Scholar

[7] Throne JL. Technology of Thermoforming, Hanser: Munich, 1996.10.3139/9783446402478Search in Google Scholar

[8] Seefried A. Zum Thermoformen von vernetztem Polyamid, Lehrstuhl für Kunststofftechnik, Ed., Ph.D. thesis, Erlangen, 2015.Search in Google Scholar

[9] Bauwens JC, Bauwens-Crowet C, Homès G. J. Polym. Sc.: Part A2 1969, 7, 1745–1754.10.1002/pol.1969.160071010Search in Google Scholar

[10] Cao K, Wang Y, Wang Y. Int. J. Solid Struct. 2014, 51, 2539–5248.10.1016/j.ijsolstr.2014.03.026Search in Google Scholar

[11] Mulliken AD, Boyce MC. Int. J. Solid Struct. 2006, 43, 1331–1356.10.1016/j.ijsolstr.2005.04.016Search in Google Scholar

[12] Dreuth H, Heiden C. Sens. Actuators A Phys. 1999, 78, 198–204.10.1016/S0924-4247(99)00237-XSearch in Google Scholar

[13] Chang J-H, Yang S-Y. Microsyst. Technol. 2003, 10, 76–80.10.1007/s00542-003-0311-1Search in Google Scholar

[14] Truckenmüller R, Rummler Z, Schaller T, Schomburg WK. J. Micromech. Microeng. 2002, 12, 375–379.10.1088/0960-1317/12/4/304Search in Google Scholar

[15] Truckenmüller R, Giselbrecht S, Rivron N, Gottwald E, Saile V, van den Berg A, Wessling M, van Blitterswijk C. Adv. Mater. 2011, 23, 1311–1329.10.1002/adma.201003538Search in Google Scholar PubMed

[16] Truckenmüller R, Giselbrecht S. IEEE Proc. Nanobiotechnol. 2004, 151, 163–166.10.1049/ip-nbt:20040823Search in Google Scholar

[17] Truckenmüller R, Giselbrecht S, van Blitterswijk C, Dambrowsky N, Gottwald E, Mappes T, Rolletschek A, Saile V, Trautmann C, Weibezahn KF, Welle A. Lab Chip 2008, 8, 1570–1579.10.1039/b803619eSearch in Google Scholar PubMed

[18] Focke M, Kosse D, Al-Bamerni D, Lutz S, Müller C, Reinecke H, Zengerle E, von Stetten F. J. Micromech. Microeng. 2011, 21, 1–11.10.1088/0960-1317/21/11/115002Search in Google Scholar

[19] Giselbrecht S, Gietzelt T, Gottwald E, Guber AE, Trautmann C, Truckenmüller R, Weibezahn KF. IEEE Proc. Nanobiotechnol. 2004, 151, 151–157.10.1049/ip-nbt:20040824Search in Google Scholar

[20] Heilig M, Giselbrecht S, Guber A, Worgull M. Microsyst. Technol. 2010, 16, 1221–1231.10.1007/s00542-010-1072-2Search in Google Scholar

[21] Heilig M, Schneider M, Ide T, Worgull M. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010, 2010, pp. 289–294.Search in Google Scholar

[22] Focke M, Kosse D, Müller C, Reinecke H, Zengerle E, von Stetten F. Lab Chip 2010, 10, 1365–1386.10.1039/c001195aSearch in Google Scholar PubMed

[23] Giessauf J, Pillwein G, Steinbichler G. Kunststoffe Int. 2008, 98, 57–62.Search in Google Scholar

[24] Jaroschek C, Cernjak D. Kunststoffe Int. 2010, 100, 29–31.Search in Google Scholar

[25] Waterkotte B, Bally F, Nikolov PM, Waldbaur A, Rapp BE, Truckenmüller R, Lahann J, Schmitz K, Giselbrecht S. Adv. Funct. Mater. 2014, 24, 442–450.10.1002/adfm.201301093Search in Google Scholar

[26] Fernekorn U, Hampl J, Weise F, Augspurger C, Hildmann C, Klett M, Läffert A, Gebinoga M, Weibezahn K-F, Schlingloff G, Worgull M, Schneider M, Schober A. Eng. Life Sci. 2011, 11, 133–139.10.1002/elsc.201000145Search in Google Scholar

[27] Seefried A, Drummer D. SPE Proc. ANTEC Las Vegas (USA) 2014, 60, 2400–2407.Search in Google Scholar

Received: 2015-5-28
Accepted: 2015-9-15
Published Online: 2015-12-2
Published in Print: 2016-8-1

©2016 Walter de Gruyter GmbH, Berlin/Boston

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