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Technical feasibility of a new approach to electromagnetic interference (EMI) shielding of injection molded parts using in-mold coated (IMC) nanopaper

  • Eusebio Duarte Cabrera , Seunghyun Ko , Xilian Ouyang , Elliott Straus , L. James Lee and Jose M. Castro EMAIL logo
Published/Copyright: May 29, 2014
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Abstract

Electromagnetic interference (EMI) is a disturbance that affects an electrical circuit due to electromagnetic radiation emitted from an external source. EMI may induce malfunction of equipment, interference with telecommunications and degradation up to total loss of data. EMI shielding refers to the reflection and/or adsorption of electromagnetic radiation by a highly electrically conductive material, usually metal, or polymer composites filled with conductive fillers. However, metal coatings tend to corrode and acceptable EMI shielding levels are difficult to achieve using conductive fillers in a thermoplastic matrix. This study presents a new approach to EMI shielding of plastic parts using in-mold coated (IMC) nanoparticle thin films or nanopapers to create a highly conductive top layer. EMI shielding effectiveness (SE) and electrical conductivity were measured.


Corresponding author: Jose M. Castro, Department of Integrated System Engineering, The Ohio State University, Columbus, OH, USA, e-mail:

Acknowledgments

We thank the Ohio State University Center for Advanced Polymers and Composites Engineering (CAPCE) for funding this study.

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Received: 2014-3-4
Accepted: 2014-5-8
Published Online: 2014-5-29
Published in Print: 2014-10-1

©2014 by De Gruyter

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