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Molecular design of soluble poly(amide-imide) with high char yield for flame retardant epoxy resin

  • Yanbin Wang EMAIL logo , Weiwei Zhang , Changlong Zhuang and Shengang Xu EMAIL logo
Published/Copyright: June 13, 2023
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Abstract

In this study, a noncoplanar diimide diacid monomer (DIDA) was synthesized by direct condensation of trimellitic anhydride (TMA) with m-tolidine. The noncoplanar unit was incorporated into poly(amide-imide)s (PAIs) main chain by Yamazaki-Higashi phosphorylation of DIDA with various aromatic diamines. Encouragingly, all of the PAIs show good solubility in some common solvents such as N,N-Dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), and m-cresol. In addition, the soluble PAIs show good optical transmittances of beyond 85 % at 500 nm due to the decreased crystallization ability. On the other hand, PAIs possess good mechanical properties with tensile strengths of 72–90 MPa and tensile moduli beyond 2 GPa. Meanwhile, the designed PAIs also exhibit excellent thermal properties: their glass transition temperatures (Tg) range from 278 to 314 °C, initial decomposition temperatures (5 % weight loss temperatures, T5wt%) are beyond 470 °C, coefficients of thermal expansion (CTE) are below 10 ppm/°C. The excellent mechanical and thermal properties are due to the strengthened hydrogen bonding interaction among the amide groups. Therefore, it is believed that incorporating noncoplanar unit and amide group into the polymer main chain at the same time can simultaneously improve processability, optical transparency, mechanical and thermal properties. Furthermore, it is worth noting that the char of PAI at 800 °C is as high as 72.5 %, which is one of the highest known values. When PAI was incorporated into epoxy resin, the blend passed UL94 V-0 rating due to the high charring capability of PAI.


Corresponding authors: Yanbin Wang, School of Materials Science and Engineering, Zhengzhou University, Zhengzhou, 450001, People’s Republic of China; and School of Materials Science and Engineering, Changzhou University, Changzhou, Jiangsu, 213164, People’s Republic of China, E-mail: ; and Shengang Xu, School of Materials Science and Engineering, Zhengzhou University, Zhengzhou, 450001, People’s Republic of China, E-mail:

  1. Author contribution: The manuscript was written through contributions of all authors. All authors have given approval to the final version of the manuscript.

  2. Research funding: This work was supported by the Natural Science Foundation of Jiangsu Province (BK20160280), the Postgraduate Research & Practice Innovation Program of Jiangsu Province (SJCX22_1328).

  3. Conflict of interest statement: The authors declare no conflicts of interest regarding this article.

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Received: 2023-04-19
Accepted: 2023-05-18
Published Online: 2023-06-13
Published in Print: 2023-09-26

© 2023 Walter de Gruyter GmbH, Berlin/Boston

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