Home Causes of Deterioration of UF Chipboard under Cyclic Humidity Conditions - I. Performance of UF Adhesive Films
Article
Licensed
Unlicensed Requires Authentication

Causes of Deterioration of UF Chipboard under Cyclic Humidity Conditions - I. Performance of UF Adhesive Films

  • J. M. Dinwoodie
Published/Copyright: July 29, 2009
Become an author with De Gruyter Brill
Holzforschung
From the journal Volume 31 Issue 2

Published Online: 2009-07-29
Published in Print: 1977

Walter de Gruyter

Downloaded on 25.10.2025 from https://www.degruyterbrill.com/document/doi/10.1515/hfsg.1977.31.2.50/html
Scroll to top button