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Substrate Integrated Circuits (SICs) for Terahertz Electronics and Photonics: Current Status and Future Outlook

  • Ke Wu EMAIL logo
Published/Copyright: September 2, 2011
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Frequenz
From the journal Volume 65 Issue 9-10

Abstract

This paper attempts to provide a panoramic picture of research and development of substrate integrated circuits (SICs), presumably the next generation of integrated circuits for GHz and THz electronics and photonics. Current status and future outlook of SICs-related research and development are briefly discussed with focus on THz. WITH interest in low-cost and matured cmos and si-related technologies, we examine the possibility of developing innovative SICs within such platforms. This may be enabled by rapid deployment of through-silicon via (TSV) processes and related 3-D silicon stacking techniques as well as material research progress such as nanostructured techniques in this way, SICs may allow us to anticipate and extrapolate the trends of their applications towards the THz frequency range where no tangible integrated circuits technology is available yet to date. Challenging issues and future directions are considered, pointing to a potentially cost-effective and performance-promising ICs solution for mass commercial applications.


Corresponding author: Ke Wu, École Polytechnique Montreal, P.O. Box 6079, Station Centre-Ville, Montreal (Quebec), H3C 3A7, Canada.

Received: 2011-07-18
Published Online: 2011-09-02
Published in Print: 2011-September

Copyright © 2011 De Gruyter

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