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A full-process chain assessment for nanoimprint technology on 200-mm industrial platform

  • Hubert Teyssedre EMAIL logo , Stefan Landis , Christine Thanner , Maria Laure , Jonas Khan , Sandra Bos , Martin Eibelhuber , Mustapha Chouiki , Michael May , Pierre Brianceau , Olivier Pollet , Jerome Hazart , Cyrille Laviron , Laurent Pain and Markus Wimplinger
Published/Copyright: May 10, 2017
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Advanced Optical Technologies
From the journal Advanced Optical Technologies Volume 6 Issue 3-4

Abstract

To evaluate the maturity of the wafer-scale NanoImprint lithography (NIL) process, laboratory of electronic and communication technology (LETI) and EV Group (EVG) launched the Imprint Nanopatterning Solution Platform for Industrial Assessment program (INSPIRE), which aims at building a nanoimprint solution platform for industrial assessment and provide a unique open ecosystem for the standardization of the nanoimprint process. This program enabled to gather EVG know-how for the tool manufacturing and its long expertise in bonding activities, and the established methods and advanced microelectronic environment. Presented as an upstream phase, metrology and defectivity were performed on dedicated assessment designs to address critical dimension uniformity (CDU) at wafer scale for a large number of imprints, defectivity on imprints and masters, and alignment capabilities of the nanoimprint HERCULES® platform of EVG. We demonstrate that the critical points are the anti-sticking layer for the defectivity, the CD shrinkage for the CDU, and the stiffness of the soft stamp for the overlay uniformity. Thus, we bring to light the actual capabilities of the HERCULES® platform, and open the discussions on the opportunities for this technology with the possible improvements for the process.

Keywords: CDU; defectivity; high-volume manufacturing; nanoimprint; overlay; UV-NIL

Acknowledgment

This work has been made possible, thanks to the inspire program.

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Published Online: 2017-5-10
Published in Print: 2017-6-27

©2017 THOSS Media & De Gruyter, Berlin/Boston

Articles in the same Issue

  1. Cover and Frontmatter
  2. Views
  3. Patterning roadmap: 2017 prospects
  4. Community
  5. Conference Notes
  6. News from the European Optical Society (EOS)
  7. Topical issue: Optical Nanostructuring
  8. Editorial
  9. Next-generation lithography – an outlook on EUV projection and nanoimprint
  10. Tutorial
  11. Photoresists in extreme ultraviolet lithography (EUVL)
  12. Review Articles
  13. Light sources for high-volume manufacturing EUV lithography: technology, performance, and power scaling
  14. Characterization and mitigation of 3D mask effects in extreme ultraviolet lithography
  15. EUV mask defectivity – a process of increasing control toward HVM
  16. Development and performance of EUV pellicles
  17. A review of nanoimprint lithography for high-volume semiconductor device manufacturing
  18. Large area nanoimprint by substrate conformal imprint lithography (SCIL)
  19. Laser interference patterning methods: Possibilities for high-throughput fabrication of periodic surface patterns
  20. Research Articles
  21. A full-process chain assessment for nanoimprint technology on 200-mm industrial platform
  22. Challenges of anamorphic high-NA lithography and mask making
  23. Research Article
  24. Chip bonding of low-melting eutectic alloys by transmitted laser radiation
https://doi.org/10.1515/aot-2017-0018
Keywords for this article
CDU; defectivity; high-volume manufacturing; nanoimprint; overlay; UV-NIL

Articles in the same Issue

  1. Cover and Frontmatter
  2. Views
  3. Patterning roadmap: 2017 prospects
  4. Community
  5. Conference Notes
  6. News from the European Optical Society (EOS)
  7. Topical issue: Optical Nanostructuring
  8. Editorial
  9. Next-generation lithography – an outlook on EUV projection and nanoimprint
  10. Tutorial
  11. Photoresists in extreme ultraviolet lithography (EUVL)
  12. Review Articles
  13. Light sources for high-volume manufacturing EUV lithography: technology, performance, and power scaling
  14. Characterization and mitigation of 3D mask effects in extreme ultraviolet lithography
  15. EUV mask defectivity – a process of increasing control toward HVM
  16. Development and performance of EUV pellicles
  17. A review of nanoimprint lithography for high-volume semiconductor device manufacturing
  18. Large area nanoimprint by substrate conformal imprint lithography (SCIL)
  19. Laser interference patterning methods: Possibilities for high-throughput fabrication of periodic surface patterns
  20. Research Articles
  21. A full-process chain assessment for nanoimprint technology on 200-mm industrial platform
  22. Challenges of anamorphic high-NA lithography and mask making
  23. Research Article
  24. Chip bonding of low-melting eutectic alloys by transmitted laser radiation
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