Chip bonding of low-melting eutectic alloys by transmitted laser radiation
-
Christian Hoff
,
Arjun Venkatesh
Abstract
Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.
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©2017 THOSS Media & De Gruyter, Berlin/Boston
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Articles in the same Issue
- Cover and Frontmatter
- Views
- Patterning roadmap: 2017 prospects
- Community
- Conference Notes
- News from the European Optical Society (EOS)
- Topical issue: Optical Nanostructuring
- Editorial
- Next-generation lithography – an outlook on EUV projection and nanoimprint
- Tutorial
- Photoresists in extreme ultraviolet lithography (EUVL)
- Review Articles
- Light sources for high-volume manufacturing EUV lithography: technology, performance, and power scaling
- Characterization and mitigation of 3D mask effects in extreme ultraviolet lithography
- EUV mask defectivity – a process of increasing control toward HVM
- Development and performance of EUV pellicles
- A review of nanoimprint lithography for high-volume semiconductor device manufacturing
- Large area nanoimprint by substrate conformal imprint lithography (SCIL)
- Laser interference patterning methods: Possibilities for high-throughput fabrication of periodic surface patterns
- Research Articles
- A full-process chain assessment for nanoimprint technology on 200-mm industrial platform
- Challenges of anamorphic high-NA lithography and mask making
- Research Article
- Chip bonding of low-melting eutectic alloys by transmitted laser radiation
