Determination of residual stress in bonded wood components
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Michael Scheffler
Abstract
Climate tests on double-layered samples were performed to detect deformation and induced stress concentrations. The paper is divided into two parts. The first presents experimental results for double-layered specimens. These specimens consisted of two wooden layers (each conditioned at a different climate before bonding) that were bonded using two different adhesives. The displacement field of the specimens was measured by means of digital fringe projection. The second part presents finite element results for two model stages using coupled thermal-mechanical analysis. For the first simple model, both orthotropic properties and the grain orientations were taken into account to investigate the behavior of the layers in principle. The results were compared to those for the experimental set-up. The improved second-stage model considers the adhesive layer between the wooden layers. The experimental and computational results of the improved simulation model are in good agreement. In the future, if inelastic material behavior is considered in a competitively superior manner, even better simulation results can be expected.
©2007 by Walter de Gruyter Berlin New York
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Articles in the same Issue
- To all readers, authors and subscribers
- Vapor-phase diethyl oxalate pretreatment of wood chips: Part 1. Energy savings and improved pulps
- Vapor-phase diethyl oxalate pretreatment of wood chips: Part 2. Release of hemicellulosic carbohydrates
- Size exclusion chromatographic and UV-VIS absorption analyses of unbleached and bleached softwood kraft pulps using LiCl/1,3-dimethyl-2-imidazolidinone as a solvent
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