Ultra Thin Flip Chip Interconnects

Artikel in diesem Heft

1. Table of Contents
2. Introduction to special issue Microsystem Technologies for Autarkic Distributed Microsystems in Sensor Networks
3. The "e-Grain" Concept Building Blocks for Self-Sufficient Distributed Microsystems
4. Design Aspects of Self-Sufficient Distributed MicroSystems
5. Flexible Circuit Carrier with Integrated Passives for High Density Integration
6. Ultra Thin Flip Chip Interconnects
7. System Architecture for Low Power 24 GHz Front-End
8. Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End
9. Antenna Concepts for Ubiquitous Communication Networks: The Case of AVM
10. Autonomous Energy Supply for Electronic Grains and Wireless Sensors
11. A MAC Protocol for Wireless Sensor Networks with Multiple Selectable, Fixed-Orientation Antennas
12. Distributed Middleware for Global Knowledge in Sensor Networks
13. Demonstration of Autarkie Distributed Microsystems with Existing Hybrid Technologies