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Kinetics and dynamics of hot deformation of OFHC copper in extended temperature and strain rate ranges

  • Y. V. R. K. Prasad and K. P. Rao EMAIL logo
Published/Copyright: December 9, 2021

Abstract

The hot-deformation behavior of oxygen-free high-conductivity (OFHC) copper has been studied in the temperature range 300–950 °C and strain rate range 0.001–100 s –1 using hot-compression tests. The dynamics of the behavior is studied with the help of processing maps, and the-rate controlling processes are evaluated using the standard kinetic rate equation. The processing maps exhibited two domains: (1) in the temperature range 600–900 °C and strain rate range 0.01–10 s–1, (2) in the range 750–950 °C and 30–100 s –1. From kinetic analysis of the flow stress data, apparent activation energy values of 159 kJ/mole and 75 kJ/mole have been estimated in the above two domains, respectively. These values suggest that dislocation core self-diffusion and grain boundary self-diffusion are the rate-controlling mechanisms. In both these domains, the average grain diameter varies linearly with the Zener–Hollomon parameter.


Dr. K. P. Rao Department of Manufacturing Engineering and Engineering Management City University of Hong Kong Tat Chee Avenue, Kowloon, Hong Kong SAR, China Tel.:+852 2788 8409 Fax: +852 2788 8423

  1. The work described in this paper was fully supported by a grant from the Research Grants Council of the Hong Kong Special Administrative Region, China (Project Ref No. CityU/1004/01E.

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Received: 2004-04-27
Accepted: 2004-10-04
Published Online: 2021-12-09

© 2005 Carl Hanser Verlag, München

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