Home Technology Intermetallic compounds at the interface between Sn–Cu(–Ni) solders and Cu substrate
Article
Licensed
Unlicensed Requires Authentication

Intermetallic compounds at the interface between Sn–Cu(–Ni) solders and Cu substrate

  • Petr Harcuba , Miloš Janeček and Margarita Slámová†
Published/Copyright: June 11, 2013
Become an author with De Gruyter Brill
Submit Manuscript Author Information
International Journal of Materials Research
From the journal International Journal of Materials Research Volume 100 Issue 6

Abstract

The influence of Cu content and Ni addition on the morphology and the growth kinetics of the intermetallic compound (IMC) layer formed at the interface of liquid Sn – Cu-based solders and the Cu substrate were investigated. The effects of temperature and reaction times on IMC morphology and thickness were studied. The reaction of a Sn-1.4Cu alloy with the substrate leads to the formation of a layer of Cu6Sn5 (-phase) of typical scallop morphology. At long reaction times, a Cu3Sn (-phase) is observed at the interface between the Cu substrate and the Cu6Sn5 layer. A small nickel addition to a Sn-0.6Cu alloy significantly changes the IMC morphology, accelerates its growth kinetics, prevents the formation of the Cu3Sn layer and reduces the rate of substrate dissolution. The effective activation energy of growth of the IMC layer in the Sn – Cu – Ni alloy was determined.

Keywords: Lead-free solders; Sn – Cu alloys; Intermetallic layer formation; Growth kinetics
* Correspondence address, Petr Harcuba, MSc. Charles University Department of Physics of Materials Ke Karlovu 5, CZ-12116 Praha 2, Czech Republic Tel.: +420 21911458 Fax: +420 2191 1490 E-mail:

References

[1] RoHS – Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, EU directive 2002/95/EC.Search in Google Scholar

[2] WEEE – Directive on Waste Electrical and Electronic Equipment, EU directive 2002/96/EC.Search in Google Scholar

[3] F.Gao, T.Takemoto: J. Electron. Mater.35 (2006) 2081.Search in Google Scholar

[4] J.I.Tsai, I.C.Hu, C.R.Kao: J. Electron. Mater.32 (2003) 1203.Search in Google Scholar

[5] F.Gao, T.Takemoto: Mater. Sci. Eng. A420 (2006) 39.Search in Google Scholar

[6] K.N.Tu: Solder Joint Technology – Materials, Properties and Reliability, Springer, New York (2007).10.1007/978-0-387-38892-2Search in Google Scholar

[7] T.Ventura, C.M.Gourlay, K.Nogita, T.Nishimura, M.Rappaz, A.Dahle: J. Electron. Mater.37 (2008) 32.Search in Google Scholar

[8] C.M.Chuang, K.L.Lin: J. Electron. Mater.32 (2003) 1426.Search in Google Scholar

[9] R.A.Gagliano, M.E.Fine: J. Electron. Mater.32 (2003) 1441.Search in Google Scholar

[10] N.Dariavach, P.Callahan, J.Liang, R.Fournelle: J. Electron. Mater.35 (2006) 1581.Search in Google Scholar

[11] J.W.Christian: The Theory of Transformations in Metals and Alloys, Pergamon, Oxford (2002).10.1016/S1369-7021(03)00335-3Search in Google Scholar

Received: 2008-8-29
Accepted: 2009-4-2
Published Online: 2013-06-11
Published in Print: 2009-06-01

© 2009, Carl Hanser Verlag, München

Articles in the same Issue

  1. Contents
  2. Contents
  3. Feature
  4. Beyond fick's equations, an overview
  5. Review
  6. The high-temperature creep properties of materials processed using severe plastic deformation
  7. Nanostructuring of metallic materials by spd processing for advanced properties
  8. Basic
  9. Some factors affecting the creep behaviour of metallic materials processed by equal-channel angular pressing
  10. The elastic–plastic transition in nanograined polycrystals
  11. Synchrotron X-ray line-profile analysis experiments for the in-situ microstructural characterisation of SPD nanometals during tensile deformation
  12. Tensile and fatigue properties of sub-microcrystalline ultra-low carbon steel produced by hpt-straining
  13. Precipitation Effects in Ultra-Fine-Grained Mg–RE Alloys
  14. EBSD investigation of the grain boundary distributions in ultrafine-grained Cu and Cu–Zr polycrystals prepared by equal-channel angular pressing
  15. Acoustic emission study of the deformation behaviour of magnesium sheets
  16. Mechanical properties of pure titanium and Ti-6Al-4V alloys with a new tailored nano/meso hybrid microstructure
  17. In-situ SEM/EBSD observation of abnormal grain growth in electrodeposited nanocrystalline nickel
  18. High-temperature creep properties of Fe–Al alloys modified by Zr
  19. ALCHEMI study of chromium doped iron-aluminides
  20. Intermetallic compounds at the interface between Sn–Cu(–Ni) solders and Cu substrate
  21. The effect of the microstructure on elastic properties of a polycrystalline stoichiometric NiAl
  22. Ab-initio simulation of the tensile strength of silicon nanofilms
  23. New properties of halogen plasma-treated Cu films
  24. Applied
  25. High-speed deformation of titanium during dynamic channel-angular pressing
  26. Microstructural evolution of equal-channel angular pressed interstitial-free steel
  27. Effect of equal channel angular pressing on microstructure, texture, and high-cycle fatigue performance of wrought magnesium alloys
  28. The characteristics of superplastic flow in a magnesium alloy processed by ECAP
  29. Deformation behaviour of ultrafine-grained 7075 aluminium alloy
  30. The optimization of ECAP conditions to achieve high strain-rate superplasticity in a Zr- and Sc-modified aa 7075 aluminum alloy
  31. Multilayer composite al99.99/almg3 sheets prepared by accumulative roll bonding
  32. Preparation of ultrafine-grained twin-roll cast AlMg3 sheets by accumulative roll bonding
  33. Recovery and recrystallization behavior of aluminum processed by extrusion-preceded equal channel angular pressing
  34. Low sliding-wear resistance of ultrafine-grained Al alloys and steel having undergone severe plastic deformation
  35. Study of the recrystallization of AW-5049 and AW-5754 twin-roll cast alloys by EBSD
  36. XRD profile analysis of ECAP Cu and Cu + Zr samples
  37. Stability of microstructure in silver processed by severe plastic deformation
  38. Acoustic emission study of the mechanical anisotropy of the extruded AZ31 alloy
  39. Effects of shot peening on internal friction in cp aluminum and aluminum alloy 6008
  40. Effects of grain growth on microhardness and coercivity in electrodeposited nanocrystalline nickel
  41. Strain release from pre-deformed Ni53.6Mn27.1Ga19.3 shape memory alloy during thermal cycling
  42. Simulation of the growth kinetics of FeB and Fe2B phases on the AISI M2 borided steel: Effect of the paste thickness
  43. High-pressure torsion deformation of a magnesium-based nanocomposite
  44. Fracture behavior of Mg–Li matrix composites
  45. Notifications
  46. The 80th Birthday of Dr.-Ing. Wolfgang Eychmüller
  47. Personal
https://doi.org/10.3139/146.110122
Keywords for this article
Lead-free solders; Sn – Cu alloys; Intermetallic layer formation; Growth kinetics

Articles in the same Issue

  1. Contents
  2. Contents
  3. Feature
  4. Beyond fick's equations, an overview
  5. Review
  6. The high-temperature creep properties of materials processed using severe plastic deformation
  7. Nanostructuring of metallic materials by spd processing for advanced properties
  8. Basic
  9. Some factors affecting the creep behaviour of metallic materials processed by equal-channel angular pressing
  10. The elastic–plastic transition in nanograined polycrystals
  11. Synchrotron X-ray line-profile analysis experiments for the in-situ microstructural characterisation of SPD nanometals during tensile deformation
  12. Tensile and fatigue properties of sub-microcrystalline ultra-low carbon steel produced by hpt-straining
  13. Precipitation Effects in Ultra-Fine-Grained Mg–RE Alloys
  14. EBSD investigation of the grain boundary distributions in ultrafine-grained Cu and Cu–Zr polycrystals prepared by equal-channel angular pressing
  15. Acoustic emission study of the deformation behaviour of magnesium sheets
  16. Mechanical properties of pure titanium and Ti-6Al-4V alloys with a new tailored nano/meso hybrid microstructure
  17. In-situ SEM/EBSD observation of abnormal grain growth in electrodeposited nanocrystalline nickel
  18. High-temperature creep properties of Fe–Al alloys modified by Zr
  19. ALCHEMI study of chromium doped iron-aluminides
  20. Intermetallic compounds at the interface between Sn–Cu(–Ni) solders and Cu substrate
  21. The effect of the microstructure on elastic properties of a polycrystalline stoichiometric NiAl
  22. Ab-initio simulation of the tensile strength of silicon nanofilms
  23. New properties of halogen plasma-treated Cu films
  24. Applied
  25. High-speed deformation of titanium during dynamic channel-angular pressing
  26. Microstructural evolution of equal-channel angular pressed interstitial-free steel
  27. Effect of equal channel angular pressing on microstructure, texture, and high-cycle fatigue performance of wrought magnesium alloys
  28. The characteristics of superplastic flow in a magnesium alloy processed by ECAP
  29. Deformation behaviour of ultrafine-grained 7075 aluminium alloy
  30. The optimization of ECAP conditions to achieve high strain-rate superplasticity in a Zr- and Sc-modified aa 7075 aluminum alloy
  31. Multilayer composite al99.99/almg3 sheets prepared by accumulative roll bonding
  32. Preparation of ultrafine-grained twin-roll cast AlMg3 sheets by accumulative roll bonding
  33. Recovery and recrystallization behavior of aluminum processed by extrusion-preceded equal channel angular pressing
  34. Low sliding-wear resistance of ultrafine-grained Al alloys and steel having undergone severe plastic deformation
  35. Study of the recrystallization of AW-5049 and AW-5754 twin-roll cast alloys by EBSD
  36. XRD profile analysis of ECAP Cu and Cu + Zr samples
  37. Stability of microstructure in silver processed by severe plastic deformation
  38. Acoustic emission study of the mechanical anisotropy of the extruded AZ31 alloy
  39. Effects of shot peening on internal friction in cp aluminum and aluminum alloy 6008
  40. Effects of grain growth on microhardness and coercivity in electrodeposited nanocrystalline nickel
  41. Strain release from pre-deformed Ni53.6Mn27.1Ga19.3 shape memory alloy during thermal cycling
  42. Simulation of the growth kinetics of FeB and Fe2B phases on the AISI M2 borided steel: Effect of the paste thickness
  43. High-pressure torsion deformation of a magnesium-based nanocomposite
  44. Fracture behavior of Mg–Li matrix composites
  45. Notifications
  46. The 80th Birthday of Dr.-Ing. Wolfgang Eychmüller
  47. Personal
Sign up now to receive a 20% welcome discount
Institutional Access
How does access work?
Have an idea on how to improve our website?
Please write us.
© 2025 De Gruyter Brill
Downloaded on 31.12.2025 from https://www.degruyterbrill.com/document/doi/10.3139/146.110122/pdf
Scroll to top button